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US 2026/0147034 A1Published application
Contactless electrical inspection process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMill-Jer Wang, Zhihua Zou, Ting-Pu Tai, Kam Heng Lee
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Abstract
A method including the following steps is provided: providing a first electronic component; providing a second electronic component; performing a bonding process to bond the first electronic component and the second electronic component; and performing an inspection process during or after the bonding process, wherein the inspection process includes a contactless inspection process.
Claims20
A method, comprising:
- providing a first electronic component;
- providing a second electronic component;
- performing a bonding process to bond the first electronic component and the second electronic component;
- and
- performing an inspection process during or after the bonding process, wherein the inspection process comprises a contactless inspection process.
2 more elements
A method, comprising:
- providing a first electronic component;
- providing a second electronic component;
- performing a bonding process to bond the first electronic component and the second electronic component;
- and
- performing an inspection process in a low-pressure environment during or after the bonding process, wherein a gas pressure in the low-pressure environment is less than or approximately equal to 100 Pa.
2 more elements
A method, comprising:
- providing a first electronic component;
- providing a second electronic component;
- performing a bonding process to bond the first electronic component and the second electronic component;
- and
- performing an inspection process, wherein the inspection process comprises determining an electrical property between a first conductor and a second conductor of the first electronic component or the second electronic component by an inspecting image corresponding to the second conductor.
2 more elements
Dependencies are inferred from the claim text.