Stepper type test structures and methods for inspection of semiconductor integrated circuits

A method of inspecting a sample, comprising:

• a. moving to a first field associated with a first group of test structures, the first group of test structures being partially within the first field and partially outside the first field;
• b. with a charged particle beam, scanning the first field to determine whether there are any defects present within the first group of test structures which are within the first field and which are outside the first field, wherein the determination is based on charged particles emitted from the first group of test structures in response to the scanning of the charged particle beam;
• and
• c. when it is determined that there are defects within the first group of test structures, repeatedly stepping to areas and scanning such areas so as to determine a specific defect location within the first group of test structures.