G01R 31/2875
Related to heating
Official title: {related to heating}
G01R31/2875 (Related to heating) appears on 401 US grants and 456 published applications in this corpus.
Search patents in G01R- Granted patents
- 401
- Published applications
- 456
- Assignees
- 199
- Inventors
- 962
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 0 |
| 2002 | 4 | 5 |
| 2003 | 3 | 3 |
| 2004 | 2 | 4 |
| 2005 | 5 | 13 |
| 2006 | 9 | 5 |
| 2007 | 10 | 17 |
| 2008 | 8 | 11 |
| 2009 | 10 | 17 |
| 2010 | 10 | 11 |
| 2011 | 7 | 9 |
| 2012 | 7 | 7 |
| 2013 | 7 | 11 |
| 2014 | 12 | 9 |
| 2015 | 12 | 14 |
| 2016 | 16 | 21 |
| 2017 | 18 | 26 |
| 2018 | 20 | 24 |
| 2019 | 23 | 19 |
| 2020 | 19 | 20 |
| 2021 | 18 | 31 |
| 2022 | 35 | 45 |
| 2023 | 43 | 26 |
| 2024 | 22 | 32 |
| 2025 | 34 | 43 |
| 2026 | 26 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Probe mounting structure and reliability test system for wafer-level reliability test22 Sep 2026US 12,742,814 B2Semight Instruments Co., Ltd
- Small device testing using thermesthesiometer22 Sep 2026US 12,742,815 B2SanDisk Technologies LLC
- Test environment control system22 Sep 2026US 12,742,816 B2Yishi Industrial Co., Ltd
- Tamper-aware age sensor15 Sep 2026US 12,736,579 B2Imec Vzw
- Test substrate, test apparatus, and test method for semiconductor integrated circuit8 Sep 2026US 12,730,142 B2Kioxia Corporation
- Integrated heater and cold plate for test applications8 Oct 2026US 2026/0313752 A1AEM Singapore Pte. Ltd.
- System for thermal testing a wafer chuck and methods for performing the same24 Sep 2026US 2026/0287645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electromigration evaluation methodology with consideration of heat dissipating structure effects17 Sep 2026US 2026/0276698 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method and system for testing the resilience of an electronic device that in use is subjected to periodic deformations17 Sep 2026US 2026/0276699 A1
- Method and system for thermal control of devices in an electronics tester17 Sep 2026US 2026/0276734 A1Aehr Test Systems
Most cited
By later US patents
- Electric probing-test machine having a cooling system233US 5,084,671 ATokyo Electron Limited · 1992
- Electric probing-test machine having a cooling system170US 5,198,752 ATokyo Electron Limited · 1993
- Temperature stable cryogenic probe station108US 5,097,207 AJohn H. Blanz Company, Inc. · 1992
- Probe card cooling assembly with direct cooling of active electronic components97US 6,891,385 B2FormFactor, Inc. · 2005
- High efficiency cryogenic test station96US 5,166,606 AJohn H. Blanz Company, Inc. · 1992