Test substrate, test apparatus, and test method for semiconductor integrated circuit
AssigneeKioxia Corporation
InventorTaisuke Ichikawa
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a test substrate of a semiconductor integrated circuit includes: a substrate connected between a burn-in apparatus and a burn-in board on which a semiconductor integrated circuit which is a device under test is mounted, and a test circuit disposed on the substrate and configured to extend a connection interface configuration between the burn-in apparatus and the burn-in board.
Claims7
A test substrate for a semiconductor integrated circuit, the test substrate comprising:
- a substrate connected between a burn-in apparatus and a burn-in board on which the semiconductor integrated circuit which is a device under test is mounted;
- a test circuit disposes on the substrate, the test circuit configured to extend a connection interface configuration between the burn-in apparatus and the burn-in board;
- an edge connector for connecting to the burn-in apparatus;
- and an edge connector socket connected to the burn-in board, wherein
- the test circuit comprises at least one selected from the group consisting of:
- a scramble circuit comprising a relay element for interchanging a pin assignment between the burn-in apparatus and the burn-in board;
- a power supply circuit comprising a DC/DC converter configured to step down a power supply voltage to be supplied to the burn-in board from the burn-in apparatus;
- a switching circuit configured to mask a signal supplied from the burn-in apparatus to the burn-in board and to switch the signal for each burn-in board;
- a switch circuit configured to select a signal supplied from the burn-in apparatus to the burn-in board;
- and
- an input circuit for plurality of resources configured to supply resources of a plurality of slots from the burn-in apparatus to the one burn-in board.
A test apparatus for a semiconductor integrated circuit, the test apparatus comprising:
- a burn-in apparatus;
- a burn-in board on which the semiconductor integrated circuit which is a device under test is mounted;
- and
- a test substrate connected between the burn-in apparatus and the burn-in board, wherein
- the test substrate comprises:
- a test circuit configured to extend a connection interface configuration between the burn-in apparatus and the burn-in board;
- an edge connector for connecting to the burn-in apparatus;
- and
- an edge connector socket connected to the burn-in board, and
- the test circuit comprises at least one selected from the group consisting of:
- a scramble circuit comprising a relay element for interchanging a pin assignment between the burn-in apparatus and the burn-in board;
- a power supply circuit comprising a DC/DC converter configured to step down a power supply voltage to be supplied to the burn-in board from the burn-in apparatus;
- a switching circuit configured to mask a signal supplied from the burn-in apparatus to the burn-in board and to switch the signal for each burn-in board;
- a switch circuit configured to select a signal supplied from the burn-in apparatus to the burn-in board;
- and
- an input circuit for plurality of resources configured to supply resources of a plurality of slots from the burn-in apparatus to the one burn-in board.
A test method used for a test apparatus for a semiconductor integrated circuit, the test apparatus comprising a burn-in apparatus, a burn-in board on which the semiconductor integrated circuit which is a device under test is mounted, and a test substrate comprising a test circuit connected between the burn-in apparatus and the burn-in board and configured to extend a connection interface configuration between the burn-in apparatus and the burn-in board, the test method comprising:
- starting, by the burn-in apparatus, the burn-in board;
- starting, by the burn-in board, the test circuit;
- extending, by the test circuit, the connection interface configuration;
- executing, by the burn-in board, a test of the device under test mounted on the burn-in board;
- ending, by the burn-in board, the test of the device under test mounted on the burn-in board;
- stopping, by the burn-in board, the test circuit;
- and
- stopping, by the burn-in apparatus, the burn-in board wherein
- the extending the connection interface configuration comprises at least any one of:
- interchanging, by a relay element, a pin assignment between the burn-in apparatus and the burn-in board;
- stepping down, by a DC/DC converter, a power supply voltage supplied from the burn-in apparatus to the burn-in board;
- masking, by a switching circuit, a signal supplied from the burn-in apparatus to the burn-in board, and switching the signal for each burn-in board;
- selecting, a switch circuit, the signal supplied from the burn-in apparatus to the burn-in board;
- and
- supplying, by an input circuit for plurality of resources, resources of a plurality of slots from the burn-in apparatus to one burn-in board.
Dependencies are inferred from the claim text.