G01R 31/2874
Related to temperature
Official title: {related to temperature}
G01R31/2874 (Related to temperature) appears on 1,138 US grants and 1,279 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,138
- Published applications
- 1,279
- Assignees
- 416
- Inventors
- 2,433
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 8 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 11 | 0 |
| 2000 | 10 | 0 |
| 2001 | 16 | 0 |
| 2002 | 17 | 22 |
| 2003 | 18 | 15 |
| 2004 | 13 | 26 |
| 2005 | 23 | 38 |
| 2006 | 39 | 38 |
| 2007 | 35 | 51 |
| 2008 | 25 | 52 |
| 2009 | 37 | 42 |
| 2010 | 39 | 45 |
| 2011 | 26 | 28 |
| 2012 | 23 | 22 |
| 2013 | 25 | 37 |
| 2014 | 32 | 41 |
| 2015 | 31 | 37 |
| 2016 | 41 | 49 |
| 2017 | 45 | 54 |
| 2018 | 55 | 78 |
| 2019 | 62 | 48 |
| 2020 | 47 | 66 |
| 2021 | 54 | 77 |
| 2022 | 85 | 84 |
| 2023 | 90 | 92 |
| 2024 | 68 | 77 |
| 2025 | 71 | 91 |
| 2026 | 48 | 69 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Probe mounting structure and reliability test system for wafer-level reliability test22 Sep 2026US 12,742,814 B2Semight Instruments Co., Ltd
- Small device testing using thermesthesiometer22 Sep 2026US 12,742,815 B2SanDisk Technologies LLC
- Test environment control system22 Sep 2026US 12,742,816 B2Yishi Industrial Co., Ltd
- Tamper-aware age sensor15 Sep 2026US 12,736,579 B2Imec Vzw
- Parallel dipole line photo-hall system with temperature gradient stage15 Sep 2026US 12,736,580 B2International Business Machines Corporation
- Probe station device8 Oct 2026US 2026/0309769 A1Korea Basic Science Institute
- Method for testing semiconductor structure8 Oct 2026US 2026/0309773 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated heater and cold plate for test applications8 Oct 2026US 2026/0313752 A1AEM Singapore Pte. Ltd.
- System for thermal testing a wafer chuck and methods for performing the same24 Sep 2026US 2026/0287645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation device and heat dissipation method for testing equipment24 Sep 2026US 2026/0287646 A1Siliconware Precision Industries Co., Ltd.
Most cited
By later US patents
- Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly532US 6,091,062 AKinetrix, Inc. · 2000
- Electric probing-test machine having a cooling system233US 5,084,671 ATokyo Electron Limited · 1992
- Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support177US 5,034,688 AETS Gourdon · 1991
- Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer173US 5,701,666 AMotorola, Inc. · 1997
- Electric probing-test machine having a cooling system170US 5,198,752 ATokyo Electron Limited · 1993