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AssigneeETS Gourdon
InventorsDaniel Moulene, Pierre Gourdon
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The invention concerns a temperature conditioning support for thermal tests on small objects such as semiconductor wafers incorporating integrated circuits. It consists of a platen and a hollow base. Inside the hollow cavity is contained a serpentine which can convey thermal fluid capable of heating and/or cooling the platen to achieve temperature regulation of the object placed on the platen, according to data supplied by a thermometric system that includes a temperature sensor associated to said support. The platen is made of electrically insulating and thermally conducting ceramic, the base being made of a material whose thermal expansion coefficient is substantially equal to that of the platen. A thin-film electrical resistance can be provided to ensure heating and, optionally, temperature measurement of the platen.
A temperature conditioning support suitable for conducting thermal tests on semi-conductor components containing integrated circuits, comprising a platen comprising an electrically insulating and thermally conducting ceramic material and a base comprising a thermally insulating ceramic that receives said platen, said platen and said base being conformed such that when assembled they define an enclosed internal cavity containing within a concentric tubular system in which a thermal fluid capable of heating or cooling said platen can circulate, providing a flow path with substantially uniform cross-section forsaid fluid, the temperature of an object placed on said platen being regulated by the heating or cooling of said platen by means of data received from thermometric system having temperature sensor means associated with said support.
Dependencies are inferred from the claim text.