G01R 31/2877
Related to cooling
Official title: {related to cooling}
G01R31/2877 (Related to cooling) appears on 233 US grants and 301 published applications in this corpus.
Search patents in G01R- Granted patents
- 233
- Published applications
- 301
- Assignees
- 128
- Inventors
- 686
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 4 |
| 2003 | 2 | 2 |
| 2004 | 1 | 5 |
| 2005 | 5 | 7 |
| 2006 | 4 | 11 |
| 2007 | 7 | 6 |
| 2008 | 4 | 7 |
| 2009 | 5 | 4 |
| 2010 | 6 | 5 |
| 2011 | 3 | 2 |
| 2012 | 4 | 7 |
| 2013 | 6 | 8 |
| 2014 | 6 | 7 |
| 2015 | 7 | 6 |
| 2016 | 7 | 11 |
| 2017 | 5 | 3 |
| 2018 | 7 | 14 |
| 2019 | 7 | 9 |
| 2020 | 15 | 11 |
| 2021 | 9 | 20 |
| 2022 | 18 | 21 |
| 2023 | 27 | 28 |
| 2024 | 14 | 30 |
| 2025 | 29 | 41 |
| 2026 | 18 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Test environment control system22 Sep 2026US 12,742,816 B2Yishi Industrial Co., Ltd
- Parallel dipole line photo-hall system with temperature gradient stage15 Sep 2026US 12,736,580 B2International Business Machines Corporation
- Apparatus for testing semiconductor device test18 Aug 2026US 12,710,470 B2Thermal Solution Technology Co., Ltd.
- Independent thermal controller for memory devices and device interface boards11 Aug 2026US 12,704,544 B2Micron Technology, Inc.
- Semiconductor testing apparatus and method for testing semiconductor structure21 Jul 2026US 12,687,574 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe station device8 Oct 2026US 2026/0309769 A1Korea Basic Science Institute
- Method for testing semiconductor structure8 Oct 2026US 2026/0309773 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation device and heat dissipation method for testing equipment24 Sep 2026US 2026/0287646 A1Siliconware Precision Industries Co., Ltd.
- Reliability test platform and probe pad assembly24 Sep 2026US 2026/0287647 A1MetaPWR Electronics Co., Ltd.
- Electromigration evaluation methodology with consideration of heat dissipating structure effects17 Sep 2026US 2026/0276698 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Integrated circuit test fixture and method135US 5,198,753 ADigital Equipment Corporation · 1993
- Method and apparatus for testing of integrated circuit chips92US 5,420,520 AInternational Business Machines Corporation · 1995
- Probe card apparatus having a heating element and process for using the same80US 5,124,639 AMotorola, Inc. · 1992
- Device for compensating for a test temperature deviation in a semiconductor device handler70US 6,861,861 B2LG Electronics Inc. · 2005
- Apparatus for heating and controlling temperature in an integrated circuit chip66US 5,309,090 A1994