Probe card apparatus having a heating element and process for using the same

A probe card apparatus for functional test probing an integrated circuit wafer having a plurality of die, comprising:

• a probe card having a cavity between and through first and second opposite sides of the probe card and having a plurality of probe leads attached to predetermined positions of the first side of the probe card and extending toward the cavity for making electrical contact with the integrated circuit wafer;
• a probe card ring within a portion of the cavity to support and position the plurality of probe leads;
• and
• a heating element positioned within at least a portion of the cavity, or in contact with the probe card ring the heating element heating the plurality of probe leads to a predetermined temperature to accurately keep each probe lead at a predetermined location within the cavity.

A process for functional test probing an integrated circuit wafer using a probe card apparatus, comprising the steps of:

• providing a probe card having first and second opposite sides, a cavity which extends from the first side to the second side, and a plurality of conductive traces located on the second side of the probe card;
• providing a plurality of probe leads attached to the first side of the probe card and electrically coupled to the plurality of conductive traces;
• providing a non-conductive probe card ring located within the cavity of the probe card which is used to support the plurality of probe leads in predetermined positions, the probe card ring having a slot formed within a surface of the probe card ring;
• and
• heating the probe card ring to a predetermined temperature with a resistive heating element located, at least in part, within the slot of the probe card ring, the plurality of probe leads which are supported by the probe card ring also being heated in order to accurately keep the probe leads in the predetermined positions.