Apparatus for testing semiconductor device test
AssigneesThermal Solution Technology Co., Ltd., Byeong-gyu Choi
InventorsByeong-gyu Choi, Shunichi Muto
Life of this patent
Estimating the term…
Abstract
An apparatus for testing semiconductor device according to one embodiment comprises: a thermoelement module having both-side surfaces converted into heating surfaces or cooling surfaces according to the direction of a current; a cooling module, which is arranged on the thermoelement module and cools a thermoelement; a pusher module which is arranged under the thermoelement module, and which comes in contact with a device to be tested, mounted in a holder, so as to heat or cool the device to be tested; and a control module for controlling the direction of a current supplied to the thermoelement module according to a target temperature value.
Claims7
An apparatus for testing semiconductor device comprising:
- a thermoelectric element module having both opposing surfaces switched to a heating surface or a cooling surface according to a flow direction of current flowing in the thermoelectric element module;
- a cooling module disposed on top of the thermoelectric element module and configured to cool the thermoelectric element;
- a pusher module disposed under the thermoelectric element module and contacting a test target device mounted on a holder to heat or cool the test target device;
- and
- a control module configured to control the flow direction of the current to be supplied to the thermoelectric element module based on a target temperature value,
- wherein the thermoelectric element module includes:
- an upper substrate in contact with the cooling module;
- a lower substrate in contact with the pusher module;
- an intermediate substrate disposed between the upper substrate and the lower substrate;
- a plurality of first semiconductor elements and a plurality of second semiconductor elements disposed between the upper substrate and the intermediate substrate;
- and
- a plurality of third semiconductor elements and a plurality of fourth semiconductor elements disposed between the intermediate substrate and the lower substrate,
- wherein a temperature sensor is disposed at one side of the intermediate substrate or inside the intermediate substrate,
- wherein the control module is configured to control the flow direction of the current to be supplied to the thermoelectric element module, based on a temperature value of the intermediate substrate measured by the temperature sensor.
Dependencies are inferred from the claim text.