Independent thermal controller for memory devices and device interface boards

A method of thermal management for testing a plurality of devices under test (DUTs), the method comprising:

• accessing temperature information of a plurality of DUTs;
• controlling a plurality of fans to selectively cool the plurality of DUTs to a plurality of respective temperatures according to the temperature information, wherein each DUT of the plurality of DUTs is associated with at least one respective fan of the plurality of fans, wherein a first DUT of the plurality of DUTs is cooled independently from a second DUT of the plurality of DUTs;
• and
• performing a test on the plurality of DUTs, wherein the test is performed at the plurality of respective temperatures.

A method of thermal management for testing a plurality of devices under test (DUTs), the method comprising:

• accessing temperature information of a plurality of DUTs;
• and
• controlling a plurality of fans using thermal control signals sent by a controller board to selectively cool the plurality of DUTs to a plurality of respective temperatures according to the temperature information using an independent thermal control (ITC) device interface board (DIB), the DIB comprising:
• a temperature sensor board operable to provide the temperature information;
• and the controller board operable to send and receive the thermal control signals,
• wherein a first DUT of the plurality of DUTs is cooled independently from a second DUT of the plurality of DUTs.