System for thermal testing a wafer chuck and methods for performing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia Wei Wang, Jian Cheng Chen, Huang Tang Peng
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Abstract
A system for testing a wafer chuck includes: a thermal test vehicle (TTV) that includes a substrate and thermal probes disposed on the substrate; and a vehicle controller configured to control heating of the substrate by the thermal probes and to store temperature data generated by the thermal probes.
Claims20
A system for detecting a thermal conductivity of a wafer chuck, comprising:
- a substrate configured to contact a wafer chuck;
- thermal probes disposed on the substrate;
- and
- a vehicle controller configured to control heating of the wafer chuck by the thermal probes and to store wafer chuck temperature data generated by the thermal probes.
A system for detecting a thermal conductivity of a wafer chuck, comprising:
- a substrate configured to contact a wafer chuck;
- heaters disposed on the substrate and configured to heat the wafer chuck;
- and
- temperature sensors disposed on the substrate and configured to detect wafer chuck temperature data;
- and
- a vehicle controller configured to process the wafer chuck temperature data to determine thermal properties of the wafer chuck.
A method of detecting a thermal conductivity of a wafer chuck configured to support a semiconductor wafer, the method comprising:
- disposing a substrate on the wafer chuck, the substrate comprising heaters and temperature sensors;
- heating the wafer chuck using the heaters;
- generating wafer chuck temperature data using the temperature sensors;
- and
- processing the wafer chuck temperature data to determine thermal properties of the wafer chuck.
Dependencies are inferred from the claim text.