High efficiency cryogenic test station
AssigneeJohn H. Blanz Company, Inc.
InventorJohn H. Blanz
Life of this patent
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AssigneeJohn H. Blanz Company, Inc.
InventorJohn H. Blanz
Estimating the term…
ATE is mounted directly to a support surrounding and removably receiving probe cards of differing thickness. An electrically heated chuck having a variable heat transfer coefficient heat exchanging face confronting a liquid nitrogen supplied plenum exhibits a temperature that varies with electrical heater load, rate of liquid nitrogen supply, and heat transfer coefficient of the heat exchanging face. The rate of liquid nitrogen supply is varied as a function of whether or not the electrical heater load falls outside predetermined upper and lower bounds to establish and maintain set point temperature over a range of set point temperatures including liquid nitrogen temperature and ambient temperature. The chuck is mounted for X,Y movement on load-balanced air/vacuum bearing, and is mounted for Z movement to accommodate different thickness probe cards. A load-lock having a pivoting cassette receiving tray that pivots with a pivoting transfer arm is mounted for Z movement with the chuck. A vacuum pump selectively lowers the temperature at which the supplied liquid nitrogen boils. A positive pressure of N.sub.2 gas is maintained to prevent moisture condensation in the load-lock and on the operative surfaces of the chuck.
For use in a cryogenic test station receiving wafers having a pluality of integrated circuit devices to be tested and testing the same at any setpoint temperature over a range of setpoint temperatures and having a wafer-receiving chuck having a temperature that is cooled by a flow of a heat transfer liquid at a rate of flow and that is heated by electrical resistance heaters generating heat at a corresponding electrical power, apparatus operative to minimize both heat transfer liquid and electrical power usage in establishing and maintaining testing at any setpoint temperature, comprising:
A cryogenic test station receiving wafers having a plurality of integrated circuit devices to be tested and testing the same at any set point temperature over a range of setpoint temperatures, comprising:
Dependencies are inferred from the claim text.