G01R 1/07357
With flexible bodies
Official title: {with flexible bodies, e.g. buckling beams}
G01R1/07357 (With flexible bodies) appears on 468 US grants and 544 published applications in this corpus.
Search patents in G01R- Granted patents
- 468
- Published applications
- 544
- Assignees
- 199
- Inventors
- 813
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 9 | 0 |
| 1998 | 5 | 0 |
| 1999 | 12 | 0 |
| 2000 | 7 | 0 |
| 2001 | 18 | 10 |
| 2002 | 19 | 21 |
| 2003 | 12 | 12 |
| 2004 | 12 | 12 |
| 2005 | 17 | 24 |
| 2006 | 11 | 25 |
| 2007 | 19 | 20 |
| 2008 | 15 | 26 |
| 2009 | 11 | 18 |
| 2010 | 17 | 16 |
| 2011 | 7 | 8 |
| 2012 | 11 | 20 |
| 2013 | 6 | 12 |
| 2014 | 12 | 19 |
| 2015 | 12 | 17 |
| 2016 | 14 | 16 |
| 2017 | 16 | 17 |
| 2018 | 13 | 16 |
| 2019 | 16 | 32 |
| 2020 | 22 | 17 |
| 2021 | 18 | 15 |
| 2022 | 13 | 21 |
| 2023 | 18 | 34 |
| 2024 | 31 | 41 |
| 2025 | 21 | 34 |
| 2026 | 12 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Charge/discharge inspection device and charge/discharge inspection equipment6 Oct 2026US 12,754,239 B2Nippon Steel Texeng. Co., Ltd.
- Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure therein18 Aug 2026US 12,710,449 B2Mpi Corporation
- Integrated insulation inspection system including insulation inspection stand with conductive brushes26 May 2026US 12,638,490 B2GM Global Technology Operations LLC
- Probe card12 May 2026US 12,625,165 B2Japan Electronic Materials Corporation
- Automatic test equipment12 May 2026US 12,625,178 B2Advantest Corporation
- Conductive probing interface device8 Oct 2026US 2026/0309775 A1International Business Machines Corporation
- Probe card and method for manufacturing probe card17 Sep 2026US 2026/0276676 A1Kabushiki Kaisha Nihon Micronics
- Microelectronic devices fabricated with 3d lithography20 Aug 2026US 2026/0242205 A1Atum Works Inc.
- Probe assembly for test and burn-in having a contact probe13 Aug 2026US 2026/0235644 A1Kes Systems & Service (1993) Pte Ltd.
- Fast inspection of device under test30 Jul 2026US 2026/0219299 A1InZiv Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Composite interconnection element for microelectronic components, and method of making same229US 6,029,344 AFormFactor, Inc. · 2000
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999
- Resilient contact structures for interconnecting electronic devices194US 6,778,406 B2FormFactor, Inc. · 2004