Automatic test equipment
AssigneeAdvantest Corporation
InventorsHiroki Ichikawa, Tasuku Fujibe
Life of this patent
Estimating the term…
Abstract
An interface device is provided between a test head and a device under test (DUT). A socket board includes sockets each configured to mount a DUT, and a socket PCB having a first face that mounts the sockets and a second face provided with multiple back face electrodes. An interposer has a first face provided with multiple deformable electrodes and a second face provided with multiple non-deformable electrodes and is configured such that the multiple deformable electrodes are in contact with the multiple back face electrodes of the socket PCB. An FPC cable has multiple electrode pads to be coupled with the multiple non-deformable electrodes on the second face of the first interposer.
Claims10
An interface device provided between a test head and a device under test (DUT), comprising:
- a socket board comprising:
- a socket structured to mount the DUT;
- and a socket printed circuit board having a first face that mounts the socket and a second face provided with a plurality of back face electrodes;
- a first interposer having a first face provided with a plurality of deformable electrodes and a second face provided with a plurality of non-deformable electrodes, and structured such that the plurality of deformable electrodes are in contact with the plurality of back face electrodes of the socket printed circuit board;
- and
- wiring having a plurality of electrode pads to be coupled to the plurality of non-deformable electrodes on the second face of the first interposer.
An interface device used as a wafer motherboard provided between a test head and a wafer under test, comprising:
- a board comprising:
- a probe card;
- and a printed circuit board having a first face that mounts the probe card and a second face provided with a plurality of back face electrodes;
- a first interposer having a first face provided with a plurality of deformable electrodes and a second face provided with a plurality of non-deformable electrodes, and structured such that the plurality of deformable electrodes are in contact with the plurality of back face electrodes of the printed circuit board;
- and
- wiring having a plurality of electrode pads to be coupled to the plurality of non-deformable electrodes on the second face of the first interposer.
Dependencies are inferred from the claim text.