C23C 16/509
Using internal electrodes
Official title: using internal electrodes
C23C16/509 (Using internal electrodes) appears on 1,435 US grants and 1,652 published applications in this corpus.
Search patents in C23C- Granted patents
- 1,435
- Published applications
- 1,652
- Assignees
- 451
- Inventors
- 3,598
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 9 | 0 |
| 1984 | 11 | 0 |
| 1985 | 15 | 0 |
| 1986 | 10 | 0 |
| 1987 | 15 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 15 | 0 |
| 1991 | 13 | 0 |
| 1992 | 14 | 0 |
| 1993 | 17 | 0 |
| 1994 | 19 | 0 |
| 1995 | 13 | 0 |
| 1996 | 29 | 0 |
| 1997 | 30 | 0 |
| 1998 | 32 | 0 |
| 1999 | 41 | 0 |
| 2000 | 60 | 0 |
| 2001 | 41 | 27 |
| 2002 | 53 | 50 |
| 2003 | 32 | 58 |
| 2004 | 39 | 57 |
| 2005 | 28 | 62 |
| 2006 | 26 | 60 |
| 2007 | 21 | 72 |
| 2008 | 23 | 58 |
| 2009 | 22 | 82 |
| 2010 | 41 | 51 |
| 2011 | 32 | 71 |
| 2012 | 50 | 61 |
| 2013 | 42 | 45 |
| 2014 | 29 | 52 |
| 2015 | 43 | 54 |
| 2016 | 37 | 52 |
| 2017 | 40 | 74 |
| 2018 | 37 | 75 |
| 2019 | 61 | 68 |
| 2020 | 52 | 78 |
| 2021 | 48 | 83 |
| 2022 | 58 | 96 |
| 2023 | 52 | 87 |
| 2024 | 67 | 49 |
| 2025 | 64 | 92 |
| 2026 | 23 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Plasma chemical vapor deposition (CVD) apparatus and film forming method14 Jul 2026US 12,683,128 B2Kioxia Corporation
- Wafer placement table2 Jun 2026US 12,646,691 B2NGK Insulators, Ltd.
- Film forming method and film forming apparatus12 May 2026US 12,624,444 B2Tokyo Electron Limited
- Atomic layer deposition of silicon nitride film using helium gas plasma5 May 2026US 12,618,156 B2Tokyo Electron Limited
- Method and apparatus with high conductance components for chamber cleaning21 Apr 2026US 12,606,907 B2APPLIED Materials.Inc.
- Wafer boat assembly and semiconductor process equipment17 Sep 2026US 2026/0282816 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Film deposition carrier and film deposition apparatus27 Aug 2026US 2026/0250848 A1Suzhou Maizheng Technology Co., Ltd.
- Topology-selective deposition method and structure formed using same20 Aug 2026US 2026/0242945 A1ASM IP Holding B. V.
- Furnace tube for plasma enhanced thin film deposition13 Aug 2026US 2026/0234802 A1ACM Research Korea CO., LTD.
- Methods and systems for filling a gap13 Aug 2026US 2026/0239900 A1ASM IP Holding B. V.
Most cited
By later US patents
- High temperature multi-layered alloy heater assembly and related methods858US 6,035,101 AAPPLIED Materials.Inc. · 2000
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process777US 5,000,113 AAPPLIED Materials.Inc. · 1991
- Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition765US 6,942,753 B2APPLIED Materials.Inc. · 2005
- Apparatus and method for preventing the premature mixture of reactant gases in CVD and PECVD reactions763US 6,161,500 ATokyo Electron Limited · 2000