Wafer placement table

A wafer placement table comprising:

• a ceramic base that includes an outer peripheral part having an annular focus ring placement surface on an outer peripheral side of a central part having a circular wafer placement surface;
• a cooling base containing metal;
• and
• a bonding layer that bonds the ceramic base with the cooling base, wherein
• the outer peripheral part of the ceramic base has a thickness of less than or equal to 0.7 mm and does not incorporate an electrode;
• and
• wherein the bonding layer is a metal bonding layer;
• wherein parts exposed on a side surface of an outer peripheral part of the ceramic base, a periphery of the metal bonding layer, a side surface of the cooling base, and a top surface of the cooling base are coated with an electrically insulating film;
• and
• wherein a difference in coefficient of thermal expansion between the ceramic base and the cooling base is lower than or equal to 1×10−6/K.