C23C 16/5096
Flat-bed apparatus
Official title: {Flat-bed apparatus}
C23C16/5096 (Flat-bed apparatus) appears on 722 US grants and 833 published applications in this corpus.
Search patents in C23C- Granted patents
- 722
- Published applications
- 833
- Assignees
- 215
- Inventors
- 1,980
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 8 | 0 |
| 1994 | 8 | 0 |
| 1995 | 4 | 0 |
| 1996 | 16 | 0 |
| 1997 | 13 | 0 |
| 1998 | 18 | 0 |
| 1999 | 27 | 0 |
| 2000 | 40 | 0 |
| 2001 | 25 | 15 |
| 2002 | 29 | 28 |
| 2003 | 18 | 27 |
| 2004 | 18 | 36 |
| 2005 | 20 | 39 |
| 2006 | 12 | 38 |
| 2007 | 8 | 42 |
| 2008 | 10 | 29 |
| 2009 | 17 | 41 |
| 2010 | 18 | 23 |
| 2011 | 17 | 32 |
| 2012 | 27 | 34 |
| 2013 | 26 | 25 |
| 2014 | 17 | 17 |
| 2015 | 14 | 23 |
| 2016 | 22 | 19 |
| 2017 | 19 | 34 |
| 2018 | 19 | 34 |
| 2019 | 26 | 27 |
| 2020 | 24 | 39 |
| 2021 | 24 | 37 |
| 2022 | 19 | 55 |
| 2023 | 26 | 57 |
| 2024 | 33 | 21 |
| 2025 | 35 | 42 |
| 2026 | 10 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer placement table2 Jun 2026US 12,646,691 B2NGK Insulators, Ltd.
- Atomic layer deposition of silicon nitride film using helium gas plasma5 May 2026US 12,618,156 B2Tokyo Electron Limited
- Method and apparatus with high conductance components for chamber cleaning21 Apr 2026US 12,606,907 B2APPLIED Materials.Inc.
- High heat loss heater and electrostatic chuck for semiconductor processing21 Apr 2026US 12,606,912 B2APPLIED Materials.Inc.
- Conformal thermal CVD with controlled film properties and high deposition rate7 Apr 2026US 12,598,930 B2Lam Research Corporation
- Topology-selective deposition method and structure formed using same20 Aug 2026US 2026/0242945 A1ASM IP Holding B. V.
- Methods and systems for filling a gap13 Aug 2026US 2026/0239900 A1ASM IP Holding B. V.
- Reducing tensile film cracking13 Aug 2026US 2026/0239936 A1Lam Research Corporation
- High heat loss heater and electrostatic chuck for semiconductor processing23 Jul 2026US 2026/0209943 A1APPLIED Materials.Inc.
- Film forming method and plasma processing apparatus25 Jun 2026US 2026/0179886 A1Tokyo Electron Limited
Most cited
By later US patents
- High temperature multi-layered alloy heater assembly and related methods858US 6,035,101 AAPPLIED Materials.Inc. · 2000
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process777US 5,000,113 AAPPLIED Materials.Inc. · 1991
- Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition765US 6,942,753 B2APPLIED Materials.Inc. · 2005
- Apparatus and method for preventing the premature mixture of reactant gases in CVD and PECVD reactions763US 6,161,500 ATokyo Electron Limited · 2000