Reducing tensile film cracking

Abstract

Provided are methods and structures for keeping the integrity of layers deposited on a semiconductor wafer. Deposition of a multilayer backside layer stack may reduce incidents of cracking in a backside layer. Each of the backside layers may be deposited by a backside deposition apparatus. a method of processing a substrate during fabrication of an electronic device, the method comprising depositing one or more frontside layers on a frontside of the substrate, wherein the one or more frontside layers induce a bow in the substrate; depositing a first bulk backside layer on a backside of the substrate, wherein the first bulk backside layer reduces the bow in the substrate; depositing a crack arresting backside layer over the first backside layer; and depositing a second bulk backside layer over the second backside layer, wherein the second bulk backside layer further reduces the bow in the substrate.

Dependencies are inferred from the claim text.