C23C 16/505
Using radio frequency discharges
Official title: using radio frequency discharges
C23C16/505 (Using radio frequency discharges) appears on 2,636 US grants and 3,299 published applications in this corpus.
Search patents in C23C- Granted patents
- 2,636
- Published applications
- 3,299
- Assignees
- 719
- Inventors
- 5,996
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 11 | 0 |
| 1982 | 7 | 0 |
| 1983 | 13 | 0 |
| 1984 | 15 | 0 |
| 1985 | 19 | 0 |
| 1986 | 13 | 0 |
| 1987 | 21 | 0 |
| 1988 | 6 | 0 |
| 1989 | 13 | 0 |
| 1990 | 18 | 0 |
| 1991 | 17 | 0 |
| 1992 | 15 | 0 |
| 1993 | 24 | 0 |
| 1994 | 25 | 0 |
| 1995 | 20 | 0 |
| 1996 | 42 | 0 |
| 1997 | 38 | 0 |
| 1998 | 46 | 0 |
| 1999 | 51 | 0 |
| 2000 | 90 | 0 |
| 2001 | 65 | 43 |
| 2002 | 80 | 81 |
| 2003 | 52 | 86 |
| 2004 | 61 | 97 |
| 2005 | 43 | 97 |
| 2006 | 36 | 101 |
| 2007 | 40 | 101 |
| 2008 | 40 | 84 |
| 2009 | 37 | 125 |
| 2010 | 64 | 94 |
| 2011 | 57 | 114 |
| 2012 | 66 | 94 |
| 2013 | 66 | 86 |
| 2014 | 59 | 103 |
| 2015 | 86 | 133 |
| 2016 | 83 | 118 |
| 2017 | 75 | 152 |
| 2018 | 95 | 178 |
| 2019 | 138 | 167 |
| 2020 | 140 | 172 |
| 2021 | 110 | 174 |
| 2022 | 119 | 221 |
| 2023 | 122 | 215 |
| 2024 | 151 | 160 |
| 2025 | 152 | 198 |
| 2026 | 84 | 105 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate processing apparatus6 Oct 2026US 12,753,507 B2Tokyo Electron Limited
- Cooling frame for diffuser22 Sep 2026US 12,742,239 B2APPLIED Materials.Inc.
- In situ surface coating of process chamber15 Sep 2026US 12,738,459 B2Lam Research Corporation
- Substrate treatment apparatus and semiconductor device manufacturing method using the same15 Sep 2026US 12,738,464 B2Samsung Electronics Co., Ltd.
- Deposition methods using pulsed plasma with varying pulse frequency25 Aug 2026US 12,716,131 B2Tokyo Electron Limited
- Fluorine-containing amorphous carbon film and method for producing same8 Oct 2026US 2026/0308753 A1Keio University
- Rf impedance matching network8 Oct 2026US 2026/0311968 A1ASM America, Inc.
- Film formation method and film formation apparatus1 Oct 2026US 2026/0297728 A1Tokyo Electron Limited
- Method of manufacturing thin film by using atomic layer deposition method and method of manufacturing semiconductor device using the same1 Oct 2026US 2026/0297746 A1Samsung Electronics Co., Ltd.
- Plasma and Photon assisted Metal-Organic Chemical Vapor Deposition24 Sep 2026US 2026/0286510 A1PhantaField Inc.
Most cited
By later US patents
- High temperature multi-layered alloy heater assembly and related methods858US 6,035,101 AAPPLIED Materials.Inc. · 2000
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process777US 5,000,113 AAPPLIED Materials.Inc. · 1991
- Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition765US 6,942,753 B2APPLIED Materials.Inc. · 2005
- Apparatus and method for preventing the premature mixture of reactant gases in CVD and PECVD reactions763US 6,161,500 ATokyo Electron Limited · 2000