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US 2026/0239900 A1Published application
Methods and systems for filling a gap
AssigneeASM IP Holding B.V.
InventorsRené Henricus Jozef Vervuurt, Timothee Blanquart, Viljami Pore, Yu Xu
Life of this patent
Estimating the term…
Abstract
Disclosed are methods and systems for filling a gap. The methods and systems are useful, for example, in the field of integrated circuit manufacture.
Claims20
A system comprising:
- a reaction chamber;
- a precursor gas source comprising a metal precursor;
- a deposition reactant gas source comprising a deposition reactant;
- an active species source arranged for providing an active species;
- a conversion reactant source arranged for providing a conversion reactant;
- and
- a controller, wherein the controller is configured to control gas flow into the reaction chamber to form a layer on a substrate by:
- depositing a convertible layer on a substrate;
- and
- exposing the substrate to an active species, thereby converting at least a part of the convertible layer into a gap filling fluid,
- wherein the gap filling fluid at least partially fills a gap on the substrate.
8 more elements
A system comprising:
- a first reaction chamber;
- a second reaction chamber;
- a precursor gas source comprising a metal precursor;
- a deposition reactant gas source comprising a deposition reactant;
- an active species source arranged for providing an active species;
- a conversion reactant source arranged for providing a conversion reactant;
- and
- a controller, wherein the controller is configured to control gas flow into the first reaction chamber and the second reaction chamber to form a layer on a substrate by:
- depositing a convertible layer on a substrate in the first reaction chamber;
- and
- exposing the substrate to an active species in the second reaction chamber, thereby converting at least a part of the convertible layer into a gap filling fluid.
8 more elements
Dependencies are inferred from the claim text.