C23C 16/45525
Atomic layer deposition [ald]
Official title: {Atomic layer deposition [ALD]}
C23C16/45525 (Atomic layer deposition [ald]) appears on 6,343 US grants and 9,812 published applications in this corpus.
Search patents in C23C- Granted patents
- 6,343
- Published applications
- 9,812
- Assignees
- 1,119
- Inventors
- 10,251
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 9 | 18 |
| 2002 | 30 | 85 |
| 2003 | 55 | 144 |
| 2004 | 85 | 173 |
| 2005 | 95 | 221 |
| 2006 | 109 | 248 |
| 2007 | 86 | 221 |
| 2008 | 127 | 248 |
| 2009 | 136 | 224 |
| 2010 | 165 | 226 |
| 2011 | 151 | 243 |
| 2012 | 170 | 288 |
| 2013 | 184 | 303 |
| 2014 | 241 | 313 |
| 2015 | 253 | 475 |
| 2016 | 311 | 466 |
| 2017 | 343 | 479 |
| 2018 | 315 | 506 |
| 2019 | 403 | 546 |
| 2020 | 438 | 595 |
| 2021 | 368 | 598 |
| 2022 | 426 | 720 |
| 2023 | 420 | 703 |
| 2024 | 499 | 608 |
| 2025 | 520 | 663 |
| 2026 | 366 | 498 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Method of forming a layer by ALD6 Oct 2026US 12,753,497 B2ASM IP Holding B. V.
- Methods of growing metal-containing films6 Oct 2026US 12,753,498 B2APPLIED Materials.Inc.
- Film forming apparatus6 Oct 2026US 12,753,504 B2Tokyo Electron Limited
- Calorimetry method to measure chemical reaction heat in ALD/ALE processes using temperature-sensitive resistance coatings6 Oct 2026US 12,753,510 B2Uchicago Argonne, LLC
- Process for improving flash sintering of ceramics and improved ceramics8 Oct 2026US 2026/0308072 A1The Regents of the University of Colorado, a body corporate
- Heat management systems and methods8 Oct 2026US 2026/0308758 A1ASM IP Holding B. V.
- Thin-film deposition apparatus and method8 Oct 2026US 2026/0308760 A1Picosun Oy
- Area selective deposition of metal film on silicon containing surfaces utilizing alcohols8 Oct 2026US 2026/0308761 A1Merck Patent GmbH
- Process for preparing of transition metal-containing films8 Oct 2026US 2026/0308762 A1BASF SE
Most cited
By later US patents
- Method for producing compound thin films1,267US 4,058,430 A1977
- Sequential chemical vapor deposition1,159US 5,916,365 A1999
- Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor1,063US 6,287,965 B1Samsung Electronics Co., Ltd. · 2001
- Method of forming graded thin films using alternating pulses of vapor phase reactants1,034US 6,534,395 B2ASM Microchemistry Oy · 2003
- Apparatus and method for growth of a thin film940US 6,511,539 B1ASM America, Inc. · 2003