C23C 16/45544
Characterized by the apparatus
Official title: {characterized by the apparatus}
C23C16/45544 (Characterized by the apparatus) appears on 2,291 US grants and 3,715 published applications in this corpus.
Search patents in C23C- Granted patents
- 2,291
- Published applications
- 3,715
- Assignees
- 430
- Inventors
- 4,388
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 8 |
| 2002 | 9 | 36 |
| 2003 | 19 | 55 |
| 2004 | 29 | 66 |
| 2005 | 31 | 86 |
| 2006 | 31 | 82 |
| 2007 | 17 | 78 |
| 2008 | 39 | 75 |
| 2009 | 30 | 90 |
| 2010 | 48 | 97 |
| 2011 | 47 | 102 |
| 2012 | 65 | 122 |
| 2013 | 63 | 119 |
| 2014 | 81 | 115 |
| 2015 | 104 | 224 |
| 2016 | 135 | 202 |
| 2017 | 125 | 211 |
| 2018 | 117 | 195 |
| 2019 | 159 | 204 |
| 2020 | 170 | 211 |
| 2021 | 134 | 218 |
| 2022 | 159 | 261 |
| 2023 | 151 | 241 |
| 2024 | 196 | 211 |
| 2025 | 190 | 229 |
| 2026 | 122 | 177 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Film forming apparatus6 Oct 2026US 12,753,504 B2Tokyo Electron Limited
- Method of forming a silicon comprising layer6 Oct 2026US 12,757,656 B2ASM IP Holding B. V.
- Atomic layer deposition apparatus29 Sep 2026US 12,747,499 B2Beneq Oy
- Liquid vaporizer29 Sep 2026US 12,747,500 B2ASM IP Holding B. V.
- Substrate processing module and laser beam providing method29 Sep 2026US 12,749,663 B2Semes Co., Ltd.
- Heat management systems and methods8 Oct 2026US 2026/0308758 A1ASM IP Holding B. V.
- Thin-film deposition apparatus and method8 Oct 2026US 2026/0308760 A1Picosun Oy
- Substrate processing apparatus1 Oct 2026US 2026/0297737 A1Tokyo Electron Limited
- Collecting apparatus and collecting method1 Oct 2026US 2026/0297739 A1Jusung Engineering Co., Ltd.
- Processing method, method of manufacturing semiconductor device, recording medium, and processing apparatus1 Oct 2026US 2026/0297742 A1Kokusai Electric Corporation
Most cited
By later US patents
- Method for producing compound thin films1,267US 4,058,430 A1977
- Apparatus and method for growth of a thin film940US 6,511,539 B1ASM America, Inc. · 2003
- Apparatus for performing growth of compound thin films918US 4,389,973 AOy Lohja AB · 1983
- Vertically-stacked process reactor and cluster tool system for atomic layer deposition876US 5,879,459 AGenus, Inc. · 1999
- Method and equipment for growing thin films872US 5,711,811 AMikrokemia Oy · 1998