C23C 16/45548
Having arrangements for gas injection at different locations of the reactor for
Official title: {having arrangements for gas injection at different locations of the reactor for each ALD half-reaction}
C23C16/45548 (Having arrangements for gas injection at different locations of the reactor for) appears on 662 US grants and 1,098 published applications in this corpus.
Search patents in C23C- Granted patents
- 662
- Published applications
- 1,098
- Assignees
- 184
- Inventors
- 1,354
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 5 |
| 2003 | 3 | 5 |
| 2004 | 4 | 12 |
| 2005 | 5 | 9 |
| 2006 | 6 | 10 |
| 2007 | 0 | 11 |
| 2008 | 4 | 12 |
| 2009 | 6 | 32 |
| 2010 | 10 | 45 |
| 2011 | 9 | 43 |
| 2012 | 23 | 61 |
| 2013 | 18 | 65 |
| 2014 | 37 | 57 |
| 2015 | 41 | 95 |
| 2016 | 46 | 73 |
| 2017 | 50 | 83 |
| 2018 | 37 | 80 |
| 2019 | 55 | 59 |
| 2020 | 52 | 57 |
| 2021 | 52 | 70 |
| 2022 | 48 | 57 |
| 2023 | 44 | 54 |
| 2024 | 46 | 37 |
| 2025 | 37 | 38 |
| 2026 | 23 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Atomic layer deposition apparatus29 Sep 2026US 12,747,499 B2Beneq Oy
- Substrate processing apparatus and substrate removal method25 Aug 2026US 12,716,132 B2Tokyo Electron Limited
- Methods and systems for improved deposition products28 Jul 2026US 12,692,598 B2Lotus Applied Technology, LLC
- Roll-to-roll processing21 Jul 2026US 12,686,920 B2Kalpana Technologies B.V.
- Uniform deposition30 Jun 2026US 12,668,877 B2Picosun Oy
- Atomic layer deposition reaction chamber and an atomic layer deposition reactor1 Oct 2026US 2026/0297747 A1Beneq Oy
- Coated structured substrates and methods of making same24 Sep 2026US 2026/0284702 A13M Innovative Properties Company
- An atomic layer deposition apparatus and a method for coating a substrate24 Sep 2026US 2026/0286516 A1Beneq Oy
- Wafer treating method24 Sep 2026US 2026/0286521 A1Asahi-Utou Technology Co., Ltd.
- Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus24 Sep 2026US 2026/0286522 A1Kokusai Electric Corporation
Most cited
By later US patents
- Method for producing compound thin films1,267US 4,058,430 A1977
- Apparatus for performing growth of compound thin films918US 4,389,973 AOy Lohja AB · 1983
- Method of delivering gas into reaction chamber and shower head used to deliver gas747US 6,478,872 B1Samsung Electronics Co., Ltd. · 2002
- Assembly line processing method586US 7,153,542 B2Tegal Corporation · 2006
- Vapor growth apparatus and vapor growth method capable of growing good productivity560US 5,730,802 ASharp Kabushiki Kaisha · 1998