Substrate processing module and laser beam providing method

A substrate processing module comprising a plurality of substrate processing apparatuses used for a thermal atomic layer etching (ALE) or atomic layer deposition (ALD) process, each substrate processing apparatus comprising:

• a process chamber having a processing space therein;
• a support unit for supporting a substrate in the processing space;
• a gas supply unit for supplying a process gas into the processing space;
• a plasma source for forming plasma from the process gas supplied into the processing space;
• and
• a laser unit for heating the substrate by irradiating a pulsed laser beam onto the substrate,
• wherein the substrate processing module further comprises:
• a laser beam generator for generating a pulsed laser beam;
• and
• a laser beam distribution unit for receiving the pulsed laser beam from the laser beam generator and distributing the pulsed laser beam to the laser units of the plurality of substrate processing apparatuses at time intervals,
• wherein one cycle of the thermal ALE or ALD process is 5 seconds (s) to 60 s,
• wherein a start timing of the one cycle is shifted for the substrate processing apparatuses, and
• wherein the laser beam distribution unit distributes the pulsed laser beam to the laser units of the substrate processing apparatuses within the one cycle.