B81C 2203/0714
Forming the micromechanical structure with a cmos process
Official title: Forming the micromechanical structure with a CMOS process
B81C2203/0714 (Forming the micromechanical structure with a cmos process) appears on 163 US grants and 184 published applications in this corpus.
Search patents in B81C- Granted patents
- 163
- Published applications
- 184
- Assignees
- 74
- Inventors
- 298
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 2 |
| 2009 | 0 | 11 |
| 2010 | 8 | 20 |
| 2011 | 11 | 28 |
| 2012 | 18 | 12 |
| 2013 | 18 | 12 |
| 2014 | 12 | 16 |
| 2015 | 15 | 15 |
| 2016 | 12 | 11 |
| 2017 | 7 | 11 |
| 2018 | 11 | 12 |
| 2019 | 7 | 3 |
| 2020 | 11 | 9 |
| 2021 | 6 | 3 |
| 2022 | 4 | 6 |
| 2023 | 5 | 4 |
| 2024 | 5 | 2 |
| 2025 | 2 | 2 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS pressure sensor built using the beol metal layers of a solid-state semiconductor process11 Aug 2026US 12,703,621 B2Nanusens SL
- Microfluidic channels in a substrate with a surface covered by a layer stack13 Jan 2026US 12,521,714 B2GLOBALFOUNDRIES U. S. Inc.
- Semiconductor device and method of manufacture26 Aug 2025US 12,400,926 B2Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS device built using the BEOL metal layers of a solid state semiconductor process28 Jan 2025US 12,209,009 B2Nanusens SL
- Monolithic post complementary metal-oxide-semiconductor integration of thermoelectric-based infrared detector17 Dec 2024US 12,168,603 B2Meridian Innovation Pte Ltd
- Micro-electro-mechanical system device and manufacturing methods of mems device and semiconductor device2 Apr 2026US 2026/0091975 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and operating method thereof12 Mar 2026US 2026/0076269 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacture23 Oct 2025US 2025/0329594 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems device built using the beol metal layers of a solid state semiconductor process24 Jul 2025US 2025/0236506 A1Nanusens SL
- Sensing device and method of manufacturing sensing device4 Apr 2024US 2024/0113236 A1Innolux Corporation
Most cited
By later US patents
- Integrated micro electro-mechanical system and manufacturing method thereof101US 7,402,449 B2Hitachi, Ltd. · 2008
- Micromechanical semiconductor component and manufacturing method therefor55US 5,760,455 ASiemens Aktiengesellschaft · 1998
- CMOS-compatible MEM switches and method of making54US 6,396,368 B1HRL Laboratories, LLC · 2002
- MEMS device and method of forming the same51US 9,233,839 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Integrated circuit and fabricating method thereof34US 8,587,078 B2United Microelectronics Corp. · 2013