Semiconductor device and operating method thereof

A semiconductor device, comprising:

• a chip;
• and
• an actuating structure, mounted over the chip, wherein the actuating structure includes:
• a cavity;
• and
• a movable element, disposed over the cavity, wherein
• the movable element includes a first movable member and a second movable member,
• the first movable member includes a first piezoelectric material surrounded by a first material, and
• the second movable member includes a second piezoelectric material surrounded by a second material different from the first material.

A method of operating a semiconductor device, comprising:

• receiving a MEMS structure mounted on a packaging structure, wherein the MEMS structure includes a movable element disposed over a cavity;
• immersing the MEMS structure and the packaging structure in a tank containing a cooling liquid;
• operating the packaging structure after immersing the MEMS structure and the packaging structure;
• and
• actuating the movable element to move relative to the packaging structure,
• wherein the actuation of the movable element enhances dissipation of heat generated from the packaging structure during the operation to the cooling liquid.