Integrated micro electro-mechanical system and manufacturing method thereof

A manufacturing method of an integrated micro electro-mechanical system in which a micro machine formed by using a manufacturing technology of a semiconductor integrated circuit and a semiconductor integrated circuit are formed on a semiconductor substrate, said method comprising:

• (a) forming a mechanical structure which is a part of said micro machine;
• (b) forming an interlayer dielectric layer which covers said mechanical structure, said interlayer dielectric being formed between interconnects of said semiconductor integrated circuit;
• (c) forming a cavity in which said mechanical structure by forming a film having holes on said interlayer dielectric layer which covers said mechanical structure and etching said interlayer dielectric layer around said mechanical structure through said holes to form said cavity;
• and
• (d) sealing said cavity by sealing said holes,
• wherein said step (a), said step (b), said step (c) and said step (d) are performed by using a technology for forming an interconnect of a MOSFET,
• wherein said step (c) includes the steps of:
• (c1) forming a film having first holes and a second hole larger than said first holes therein on said interlayer dielectric;
• (c2) forming said cavity by etching said interlayer dielectric around said mechanical structure through said first holes and said second hole;
• (c3) filling said first holes with a dielectric while keeping said second hole open;
• and
• (c4) removing said dielectric formed by said step (c3) on said mechanical structure,
• wherein, in said step (d), said second hole is sealed.