B81C 2201/0132
Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [rie], sputter
Official title: Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
B81C2201/0132 (Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [rie], sputter) appears on 539 US grants and 659 published applications in this corpus.
Search patents in B81C- Granted patents
- 539
- Published applications
- 659
- Assignees
- 287
- Inventors
- 1,368
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 8 | 0 |
| 2001 | 4 | 5 |
| 2002 | 10 | 15 |
| 2003 | 9 | 13 |
| 2004 | 18 | 13 |
| 2005 | 9 | 8 |
| 2006 | 12 | 22 |
| 2007 | 8 | 12 |
| 2008 | 8 | 11 |
| 2009 | 7 | 9 |
| 2010 | 13 | 9 |
| 2011 | 5 | 10 |
| 2012 | 6 | 7 |
| 2013 | 8 | 13 |
| 2014 | 9 | 19 |
| 2015 | 20 | 25 |
| 2016 | 28 | 42 |
| 2017 | 36 | 54 |
| 2018 | 45 | 33 |
| 2019 | 33 | 38 |
| 2020 | 39 | 41 |
| 2021 | 37 | 50 |
| 2022 | 37 | 36 |
| 2023 | 35 | 43 |
| 2024 | 25 | 44 |
| 2025 | 28 | 42 |
| 2026 | 29 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite spring structure to reinforce mechanical robustness of a mems device29 Sep 2026US 12,747,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system and manufacturing method thereof29 Sep 2026US 12,747,154 B2Beijing BOE Technology Development Co., Ltd.
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Anchor structure8 Sep 2026US 12,729,107 B2Lawrence Semiconductor Research Laboratory, Inc.
- MEMS device with integrated CMOS circuit8 Sep 2026US 12,729,111 B23C Project Management Limited
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
- Methods for fabrication of mems devices17 Sep 2026US 2026/0274654 A1Omnitron Sensors Inc.
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process for producing surface micromechanical structures216US 5,683,591 ARobert Bosch GmbH · 1997
- Microelectromechanical accelerometer for automotive applications205US 6,199,874 B1Cornell Research Foundation, Inc. · 2001
- Anhydrous HF release of process for MEMS devices201US 7,365,016 B2DALSA Semiconductor Inc. · 2008
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006