B81C 2201/013
Etching
B81C2201/013 (Etching) appears on 1,275 US grants and 1,484 published applications in this corpus.
Search patents in B81C- Granted patents
- 1,275
- Published applications
- 1,484
- Assignees
- 508
- Inventors
- 2,693
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 13 | 0 |
| 1999 | 12 | 0 |
| 2000 | 17 | 0 |
| 2001 | 13 | 9 |
| 2002 | 25 | 35 |
| 2003 | 29 | 31 |
| 2004 | 32 | 31 |
| 2005 | 24 | 27 |
| 2006 | 23 | 37 |
| 2007 | 25 | 28 |
| 2008 | 19 | 28 |
| 2009 | 21 | 29 |
| 2010 | 31 | 24 |
| 2011 | 19 | 32 |
| 2012 | 18 | 25 |
| 2013 | 22 | 28 |
| 2014 | 37 | 52 |
| 2015 | 39 | 48 |
| 2016 | 61 | 107 |
| 2017 | 84 | 131 |
| 2018 | 105 | 88 |
| 2019 | 95 | 91 |
| 2020 | 100 | 86 |
| 2021 | 70 | 96 |
| 2022 | 69 | 78 |
| 2023 | 72 | 93 |
| 2024 | 63 | 89 |
| 2025 | 56 | 82 |
| 2026 | 57 | 79 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Composite spring structure to reinforce mechanical robustness of a mems device29 Sep 2026US 12,747,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system and manufacturing method thereof29 Sep 2026US 12,747,154 B2Beijing BOE Technology Development Co., Ltd.
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Microscale flexible strain sensor8 Sep 2026US 12,729,106 B2Carnegie Mellon University
- Micromechanical arm array for mems actuators8 Oct 2026US 2026/0307981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Manufacturing a microphone by bonding layers1 Oct 2026US 2026/0296881 A1InvenSense, Inc.
Most cited
By later US patents
- Method for forming micro cavity560US 6,342,427 B12002
- Lithography device for semiconductor circuit pattern generator287US 7,242,012 B2Elm Technology Corporation · 2007
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process for producing surface micromechanical structures216US 5,683,591 ARobert Bosch GmbH · 1997
- Microelectromechanical accelerometer for automotive applications205US 6,199,874 B1Cornell Research Foundation, Inc. · 2001