B81C 2201/0108
Sacrificial polymer, ashing of organics
B81C2201/0108 (Sacrificial polymer, ashing of organics) appears on 96 US grants and 114 published applications in this corpus.
Search patents in B81C- Granted patents
- 96
- Published applications
- 114
- Assignees
- 79
- Inventors
- 240
- Latest grant
- 3 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 2 |
| 2003 | 3 | 12 |
| 2004 | 3 | 6 |
| 2005 | 7 | 8 |
| 2006 | 2 | 4 |
| 2007 | 4 | 6 |
| 2008 | 2 | 3 |
| 2009 | 1 | 9 |
| 2010 | 8 | 7 |
| 2011 | 4 | 2 |
| 2012 | 5 | 2 |
| 2013 | 7 | 7 |
| 2014 | 5 | 3 |
| 2015 | 3 | 1 |
| 2016 | 1 | 7 |
| 2017 | 5 | 5 |
| 2018 | 5 | 5 |
| 2019 | 4 | 4 |
| 2020 | 2 | 4 |
| 2021 | 6 | 6 |
| 2022 | 1 | 0 |
| 2023 | 2 | 3 |
| 2024 | 4 | 5 |
| 2025 | 4 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Pressure sensor and method for manufacturing same, and electronic device3 Feb 2026US 12,540,869 B2Beijing BOE Technology Development Co., Ltd.
- MEMS device including coil structure with corrugated polymer film14 Oct 2025US 12,441,606 B2United Microelectronics Corp.
- Capless semiconductor package with a micro-electromechanical system (mems)23 Sep 2025US 12,421,108 B2STMicroelectronics S.r.l.
- Multi-level microelectromechanical system structure with non-photodefinable organic polymer spacer layers18 Mar 2025US 12,252,396 B2Texas Instruments Incorporated
- Microfluidic film and method for fabricating the microfluidic film11 Feb 2025US 12,220,696 B2Unist (Ulsan National Institute of Science and Technology)
- Method for manufacturing mems device including coil structure8 Jan 2026US 2026/0008670 A1United Microelectronics Corp.
- Multi-level microelectromechanical system structure with non-photodefinable organic polymer spacer layers5 Jun 2025US 2025/0178890 A1
- Pressure sensor and method for manufacturing same, and electronic device13 Mar 2025US 2025/0085175 A1Beijing BOE Technology Development Co., Ltd.
- Mems device with membrane and upright nanostructures1 Aug 2024US 2024/0253976 A1Infineon Technologies AG
- Mems device with membrane comprising laser structured nanostructures and method for manufacturing same1 Aug 2024US 2024/0253977 A1Infineon Technologies AG
Most cited
By later US patents
- MEMS device having contact and standoff bumps and related methods113US 6,876,482 B2Turnstone Systems, Inc. · 2005
- Trilayered beam MEMS device and related methods102US 6,746,891 B2Turnstone Systems, Inc. · 2004
- MEMS device having a trilayered beam and related methods99US 6,876,047 B2Turnstone Systems, Inc. · 2005
- Trilayered beam MEMS device and related methods93US 6,917,086 B2Turnstone Systems, Inc. · 2005
- Forming tool for forming a contoured microelectronic spring mold78US 6,780,001 B2FormFactor, Inc. · 2004