Multi-level microelectromechanical system structure with non-photodefinable organic polymer spacer layers

A method of manufacturing a microelectromechanical system (MEMS) device, the method comprising:

• depositing one or more material layers on a substrate;
• depositing an organic polymer layer on the one or more material layers;
• thermally curing the organic polymer layer;
• depositing a hard mask on the organic polymer layer;
• depositing a photoresist layer on the hard mask;
• patterning the photoresist layer to expose at least a portion of the hard mask;
• etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer;
• etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers to form an opening in the organic polymer layer;
• etching at least one of the one or more material layers;
• removing the hard mask with an etch process;
• and
• forming a metal layer on the organic polymer layer and in the opening in the organic polymer layer.

A method comprising:

• depositing an organic polymer layer on one or more material layers;
• depositing a hard mask on the organic polymer layer;
• depositing a photoresist layer on the hard mask;
• patterning the photoresist layer to expose at least a portion of the hard mask;
• etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer;
• etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers to form an opening;
• removing the hard mask;
• depositing a hinge layer on the organic polymer layer and in the opening of the organic polymer layer;
• and
• removing the organic polymer layer, to release the hinge layer.