B81C 2201/0105
Sacrificial layer
B81C2201/0105 (Sacrificial layer) appears on 479 US grants and 542 published applications in this corpus.
Search patents in B81C- Granted patents
- 479
- Published applications
- 542
- Assignees
- 247
- Inventors
- 1,033
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 12 | 0 |
| 2001 | 14 | 4 |
| 2002 | 8 | 10 |
| 2003 | 8 | 28 |
| 2004 | 22 | 29 |
| 2005 | 23 | 32 |
| 2006 | 17 | 20 |
| 2007 | 18 | 22 |
| 2008 | 12 | 8 |
| 2009 | 7 | 23 |
| 2010 | 24 | 22 |
| 2011 | 12 | 17 |
| 2012 | 13 | 9 |
| 2013 | 16 | 16 |
| 2014 | 18 | 14 |
| 2015 | 10 | 5 |
| 2016 | 10 | 32 |
| 2017 | 19 | 25 |
| 2018 | 28 | 33 |
| 2019 | 27 | 24 |
| 2020 | 31 | 35 |
| 2021 | 30 | 21 |
| 2022 | 14 | 17 |
| 2023 | 13 | 21 |
| 2024 | 20 | 30 |
| 2025 | 18 | 24 |
| 2026 | 16 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Micro-electro-mechanical system and manufacturing method thereof29 Sep 2026US 12,747,154 B2Beijing BOE Technology Development Co., Ltd.
- Micro-electro-mechanical systems and preparation method thereof25 Aug 2026US 12,715,762 B2Huawei Technologies Co., Ltd.
- Multi-level mems process18 Aug 2026US 12,709,540 B2InvenSense, Inc.
- Attachable microphone and manufacturing method therefor21 Jul 2026US 12,686,612 B2Center for Advanced Soft Electronics
- Method for manufacturing a low-noise electroacoustic transducer5 May 2026US 12,621,612 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Method for manufacturing a microelectromechanical component, and microelectromechanical component1 Oct 2026US 2026/0296882 A1
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
- Mems device and preparation therefor2 Jul 2026US 2026/0184559 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Out-of-plane micro-electromechanical device with reinforced stopper and method for manufacturing a micro-electromechanical device25 Jun 2026US 2026/0176126 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Method for fabricating a structure for a microelectromechanical systems (MEMS) device722US 6,794,119 B2Iridigm Display Corporation · 2004
- Display device with micromechanical leaf spring switches250US 4,681,403 AU. S. Philips Corporation · 1987
- Polycrystalline silicon germanium films for forming micro-electromechanical systems226US 6,210,988 B1The Regents of the University of California · 2001
- Method for forming a multilayer structure201US 8,470,689 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2013
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006