B81C 2201/0109
Sacrificial layers not provided for in b81c2201/0107 - b81c2201/0108
Official title: Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
B81C2201/0109 (Sacrificial layers not provided for in b81c2201/0107 - b81c2201/0108) appears on 301 US grants and 310 published applications in this corpus.
Search patents in B81C- Granted patents
- 301
- Published applications
- 310
- Assignees
- 149
- Inventors
- 587
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 10 | 0 |
| 2001 | 12 | 4 |
| 2002 | 5 | 8 |
| 2003 | 4 | 19 |
| 2004 | 18 | 23 |
| 2005 | 19 | 22 |
| 2006 | 15 | 15 |
| 2007 | 13 | 15 |
| 2008 | 9 | 3 |
| 2009 | 4 | 9 |
| 2010 | 14 | 13 |
| 2011 | 5 | 14 |
| 2012 | 7 | 6 |
| 2013 | 8 | 5 |
| 2014 | 11 | 8 |
| 2015 | 6 | 3 |
| 2016 | 6 | 17 |
| 2017 | 11 | 15 |
| 2018 | 18 | 21 |
| 2019 | 18 | 16 |
| 2020 | 18 | 18 |
| 2021 | 19 | 11 |
| 2022 | 9 | 8 |
| 2023 | 5 | 8 |
| 2024 | 7 | 13 |
| 2025 | 6 | 9 |
| 2026 | 7 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical systems and preparation method thereof25 Aug 2026US 12,715,762 B2Huawei Technologies Co., Ltd.
- Multi-level mems process18 Aug 2026US 12,709,540 B2InvenSense, Inc.
- Method for manufacturing a low-noise electroacoustic transducer5 May 2026US 12,621,612 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Process for manufacturing a micro-electro-mechanical device from a single semiconductor wafer and related MEMS device31 Mar 2026US 12,589,989 B2STMicroelectronics S,r.l.
- MEMS device, method for manufacturing MEMS device and electronic device10 Mar 2026US 12,570,519 B2Beijing BOE Technology Development Co., Ltd.
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
- Mems device and preparation therefor2 Jul 2026US 2026/0184559 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Pressure sensor having high detection performance and optimized manufacturing30 Apr 2026US 2026/0118197 A1STMicroelectronics International N. V.
- Engineered substrates, free-standing semiconductor microstructures, and related systems and methods23 Apr 2026US 2026/0109595 A1Lawrence Semiconductor Research Laboratory, Inc.
- Multi-cell piston motion membrane microelectromechanical systems (mems) apparatus and process16 Apr 2026US 2026/0103377 A1InvenSense, Inc.
Most cited
By later US patents
- Method for fabricating a structure for a microelectromechanical systems (MEMS) device722US 6,794,119 B2Iridigm Display Corporation · 2004
- Polycrystalline silicon germanium films for forming micro-electromechanical systems226US 6,210,988 B1The Regents of the University of California · 2001
- Method for forming a multilayer structure201US 8,470,689 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2013
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006
- Formation of microchannels from low-temperature plasma-deposited silicon oxynitride169US 6,096,656 ASandia Corporation · 2000