Pressure sensor and method for manufacturing same, and electronic device

A method for manufacturing a pressure sensor, wherein the pressure sensor has a sensing region and a non-sensing region, and the method comprises:

• providing a first flexible film layer, wherein a first groove is disposed in a first surface of the first flexible film layer, and the first groove is within the sensing region;
• forming a first electrode layer on the first surface of the first flexible film layer, wherein the first electrode layer at least comprises a first electrode and a first electrode lead connected to the first electrode, wherein the first electrode is disposed in the first groove within the sensing region, and the first electrode lead is within the non-sensing region;
• forming a first insulative layer on a side, distal from the first flexible film layer, of the first electrode layer, wherein the first insulative layer is within the non-sensing region and outside the sensing region;
• providing a second flexible film layer;
• forming a second electrode layer on a second surface of the second flexible film layer, wherein the second electrode layer at least comprises a second electrode and a second electrode lead connected to the second electrode, wherein the second electrode is within the sensing region, and the second electrode lead is within the non-sensing region;
• and
• bonding the second electrode layer with the first electrode layer by a bonding process, wherein a cavity is defined between the second electrodes and the first electrodes upon bonding, and the cavity is formed at least based on the first groove.

A method for manufacturing a pressure sensor, wherein the pressure sensor has a sensing region and a non-sensing region, and the method comprises:

• providing a first flexible film layer, wherein a first groove is disposed in a first surface of the first flexible film layer, and the first groove is within the sensing region;
• forming a first electrode layer on the first surface of the first flexible film layer, wherein the first electrode layer at least comprises a first electrode and a first electrode lead connected to the first electrode, the first electrode is disposed in the first groove within the sensing region, and the first electrode lead is within the non-sensing region;
• forming a first insulative layer on a side, distal from the first flexible film layer, of the first electrode layer, wherein the first insulative layer is within the non-sensing region and outside the sensing region;
• forming a sacrificial layer by filling in the first groove;
• forming a second electrode layer on a side, distal from the first flexible film layer, of the sacrificial layer, wherein the second electrode layer at least comprises a second electrode and a second electrode lead connected to the second electrode, wherein the second electrode is within the sensing region, and a plurality of through holes are disposed in the second electrode, and the second electrode lead is within the non-sensing region;
• removing the sacrificial layer in the first groove through the plurality of through holes by an etching solution, and upon removal of the sacrificial layer, a cavity is defined between the second electrode and the first electrode, and the cavity is formed at least based on the first groove;
• and
• forming a second flexible film layer on a side, distal from the first flexible film layer, of the second electrode layer, wherein the second flexible film layer is within the plurality of through holes.