B81C 1/00801
Avoid alteration of functional structures by etching
Official title: {Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer (B81C1/00595, B81C1/00468 take precedence)}
B81C1/00801 (Avoid alteration of functional structures by etching) appears on 152 US grants and 157 published applications in this corpus.
Search patents in B81C- Granted patents
- 152
- Published applications
- 157
- Assignees
- 75
- Inventors
- 342
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 1 |
| 2003 | 2 | 4 |
| 2004 | 3 | 5 |
| 2005 | 4 | 6 |
| 2006 | 2 | 3 |
| 2007 | 4 | 5 |
| 2008 | 3 | 8 |
| 2009 | 4 | 6 |
| 2010 | 5 | 6 |
| 2011 | 4 | 7 |
| 2012 | 3 | 8 |
| 2013 | 10 | 8 |
| 2014 | 12 | 11 |
| 2015 | 11 | 7 |
| 2016 | 9 | 16 |
| 2017 | 9 | 12 |
| 2018 | 14 | 9 |
| 2019 | 13 | 5 |
| 2020 | 10 | 6 |
| 2021 | 6 | 6 |
| 2022 | 5 | 6 |
| 2023 | 2 | 2 |
| 2024 | 3 | 4 |
| 2025 | 3 | 4 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Gas sensor and manufacturing method thereof27 May 2025US 12,313,611 B2Electronics and Telecommunications Research Institute
- MEMS display device with an etch-stop-layer13 May 2025US 12,298,493 B2IGNITE, Inc.
- Dielectric protection layer configured to increase performance of mems device8 Apr 2025US 12,269,735 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micromechanical component for a sensor device or microphone device26 Nov 2024US 12,151,936 B2Robert Bosch GmbH
- Method and carrier substrate for producing a semiconductor component2 Oct 2025US 2025/0308911 A1Jenoptik Optical System GmbH
- Chemical stop structures for mems devices24 Jul 2025US 2025/0236514 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for processing silicon substrate and method for processing liquid ejection head substrate30 Jan 2025US 2025/0033956 A1Canon Kabushiki Kaisha
- Inertial sensor and method for forming the same23 Jan 2025US 2025/0026630 A1AAC Technologies PTE.Ltd.
- Micro-electromechanical system and method for fabricating mems having protection wall26 Dec 2024US 2024/0425366 A1United Microelectronics Corp.
Most cited
By later US patents
- Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch140US 8,440,523 B1International Business Machines Corporation · 2013
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005
- Methods for producing MEMS with protective coatings using multi-component sacrificial layers62US 7,450,295 B2QUALCOMM MEMS Technologies, Inc. · 2008
- Aluminum fluoride films for microelectromechanical system applications50US 7,535,621 B2QUALCOMM MEMS Technologies, Inc. · 2009
- Methods of making a MEMS device by monitoring a process parameter44US 7,569,488 B2QUALCOMM MEMS Technologies, Inc. · 2009