Inertial sensor and method for forming the same

A method for forming an inertia sensor,

• wherein the inertia sensor comprises:
• a first substrate;
• a first insulation layer stacked on the first substrate;
• a first conducting layer stacked on the first insulation layer and comprising first openings;
• stoppers corresponding to the first openings in one-to-one correspondence and embedded into the first openings to close the first openings;
• a second insulation layer stacked on the first conducting layer and comprising a cavity;
• a second conducting layer stacked on the second insulation layer and comprising second openings;
• a first bonding structure stacked on the second conducting layer;
• a second substrate;
• and
• a second bonding structure stacked on the second substrate, the second bonding structure and the first bonding structure being bonded together, and a closed space being formed between the second substrate and the first substrate,
• and,
• wherein the method comprises:
• forming the first insulation layer and the first conducting layer at the first substrate, and forming the first openings at the first conducting layer;
• forming the stoppers at the first conducting layer, the stoppers being embedded into the first opening;
• forming the second insulation layer at the first conducting layer;
• forming the second conducting layer at the second insulation layer, forming the second opening at the second conducting layer;
• forming the cavity at the second insulation layer;
• forming the first bonding structure at the second conducting layer;
• forming the second bonding structure on the second substrate;
• and
• bonding the first bonding structure and the second bonding structure together at a high temperature, a closed space being formed between the second substrate and the first substrate.