B81C 1/00777
Preserve existing structures from alteration
Official title: {Preserve existing structures from alteration, e.g. temporary protection during manufacturing}
B81C1/00777 (Preserve existing structures from alteration) appears on 316 US grants and 354 published applications in this corpus.
Search patents in B81C- Granted patents
- 316
- Published applications
- 354
- Assignees
- 148
- Inventors
- 728
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 3 |
| 2003 | 3 | 6 |
| 2004 | 4 | 7 |
| 2005 | 7 | 11 |
| 2006 | 4 | 7 |
| 2007 | 4 | 7 |
| 2008 | 5 | 8 |
| 2009 | 7 | 12 |
| 2010 | 5 | 8 |
| 2011 | 9 | 9 |
| 2012 | 5 | 12 |
| 2013 | 14 | 17 |
| 2014 | 17 | 20 |
| 2015 | 24 | 30 |
| 2016 | 23 | 37 |
| 2017 | 36 | 32 |
| 2018 | 30 | 24 |
| 2019 | 30 | 18 |
| 2020 | 17 | 15 |
| 2021 | 14 | 15 |
| 2022 | 12 | 15 |
| 2023 | 11 | 7 |
| 2024 | 8 | 12 |
| 2025 | 10 | 16 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- Micromechanical arm array for mems actuators8 Sep 2026US 12,729,109 B2Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS device manufacturing method4 Aug 2026US 12,698,203 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Microelectromechanical membrane transducer with active damper3 Feb 2026US 12,540,071 B2STMicroelectronics S,r.l.
- Bottom package exposed die MEMS pressure sensor integrated circuit package design3 Feb 2026US 12,543,575 B2STMicroelectronics S.r.l.
- Micromechanical arm array for mems actuators8 Oct 2026US 2026/0307981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding pillar structure for hidden comb microelectromechanical system17 Sep 2026US 2026/0280449 A1Lumentum Operations LLC
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Semiconductor device and method of manufacturing same12 Mar 2026US 2026/0070086 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Barrier structure within a microelectronic enclosure4 Dec 2025US 2025/0368501 A1Texas Instruments Incorporated
Most cited
By later US patents
- Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch140US 8,440,523 B1International Business Machines Corporation · 2013
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005
- Fabrication of a surface micromachined capacitive microphone using a dry-etch process97US 5,573,679 AAlberta Microelectronic Centre · 1996
- Barrier layers for microelectromechanical systems93US 6,849,471 B2Reflectivity, INC · 2005
- Methods for producing MEMS with protective coatings using multi-component sacrificial layers62US 7,450,295 B2QUALCOMM MEMS Technologies, Inc. · 2008