B81C 1/00825
Protect against mechanical threats
Official title: {Protect against mechanical threats, e.g. against shocks, or residues (B81C1/00261 take precedence)}
B81C1/00825 (Protect against mechanical threats) appears on 91 US grants and 103 published applications in this corpus.
Search patents in B81C- Granted patents
- 91
- Published applications
- 103
- Assignees
- 53
- Inventors
- 221
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 2 | 2 |
| 2010 | 0 | 1 |
| 2011 | 2 | 1 |
| 2012 | 1 | 1 |
| 2013 | 1 | 5 |
| 2014 | 3 | 5 |
| 2015 | 6 | 12 |
| 2016 | 10 | 13 |
| 2017 | 17 | 13 |
| 2018 | 11 | 9 |
| 2019 | 10 | 6 |
| 2020 | 3 | 3 |
| 2021 | 3 | 6 |
| 2022 | 4 | 6 |
| 2023 | 6 | 4 |
| 2024 | 4 | 5 |
| 2025 | 4 | 6 |
| 2026 | 4 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- Micromechanical arm array for mems actuators8 Sep 2026US 12,729,109 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectromechanical membrane transducer with active damper3 Feb 2026US 12,540,071 B2STMicroelectronics S,r.l.
- Bottom package exposed die MEMS pressure sensor integrated circuit package design3 Feb 2026US 12,543,575 B2STMicroelectronics S.r.l.
- Mirror device manufacturing method and mirror unit manufacturing method30 Dec 2025US 12,509,347 B2Hamamatsu Photonics K.K.
- Micromechanical arm array for mems actuators8 Oct 2026US 2026/0307981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding pillar structure for hidden comb microelectromechanical system17 Sep 2026US 2026/0280449 A1Lumentum Operations LLC
- Semiconductor device and method of manufacturing same12 Mar 2026US 2026/0070086 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electromechanical systems (mems) and methods of fabricating the same27 Nov 2025US 2025/0361140 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Bottom package exposed die mems pressure sensor integrated circuit package design6 Nov 2025US 2025/0343119 A1STMicroelectronics S.r.l.
Most cited
By later US patents
- Semiconductor device package and method of manufacturing the same39US 9,722,098 B1ASE Electronics (M) Sdn. Bhd. · 2017
- MEMS structure and manufacturing method thereof13US 9,630,837 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Wafer-level packaging with compression-controlled seal ring bonding8US 8,575,748 B1Sandia Corporation · 2013
- Method for applying a structured coating to a component6US 9,556,022 B2Epcos AG · 2017
- Microminiature moving device and method of making the same4US 7,476,948 B2Japan Aviation Electronics Industry, Limited · 2009