Semiconductor device package and method of manufacturing the same
AssigneeASE Electronics (M) Sdn. Bhd.
InventorsKam Cheong Chung, Ahmad Zulmuhtasyim, Liang Peng Cheng, Lai Theng Chan
Life of this patent
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Abstract
A method of manufacturing a semiconductor device package includes disposing at least one die over a substrate, dispensing a liquid material on the die, and curing the liquid material so that the liquid material forms a protective layer attached to a portion of the die. The method further includes forming an encapsulant covering at least a portion of the substrate and a portion of the die, where the protective layer is exposed from the encapsulant in a cavity defined by the encapsulant. The method further includes removing the protective layer from the die, and disposing a cap over the cavity.
Claims20
A method of manufacturing a semiconductor device package, comprising:
- disposing at least one die over a substrate;
- dispensing a liquid material on the die;
- curing the liquid material so that the liquid material forms a protective layer attached to a portion of the die;
- forming an encapsulant covering at least a portion of the substrate and a portion of the die free of the protective layer, wherein the protective layer is exposed from the encapsulant in a cavity defined by the encapsulant;
- removing the protective layer from the die;
- and
- disposing a cap over the cavity.
A method of manufacturing an optoelectronic device package, comprising:
- disposing at least one optoelectronic die over a substrate, the optoelectronic die comprising an optical element;
- dispensing a resin material on the optoelectronic die;
- curing the resin material so that the resin material forms a protective layer covering the optical element of the optoelectronic die;
- forming a molding member defining a cavity over the substrate and the optoelectronic die, the cavity exposing the protective layer;
- removing the protective layer from the die;
- and
- disposing an electromagnetic radiation transmissive cap over the cavity.
A semiconductor device package, comprising:
- a substrate;
- at least one die disposed over the substrate;
- a plurality of conductive components electrically connecting the die to the substrate;
- an encapsulant disposed over the substrate, the encapsulant defining a cavity partially exposing an upper surface of the die, the cavity including a stepped sidewall, the stepped sidewall including:
- an inclined portion extending to the upper surface of the die, the inclined portion inclined outwardly with respect to the upper surface of the die;
- a vertical portion extending from an upper surface of the encapsulant, the vertical portion being substantially perpendicular to the upper surface of the encapsulant;
- and
- a ledge portion between the vertical portion and the inclined portion and substantially parallel to the upper surface of the encapsulant;
- and
- an electromagnetic radiation transmissive cap on the ledge portion and surrounded by the vertical portion.
Dependencies are inferred from the claim text.