B81C 1/00833
Methods for preserving structures not provided for in groups b81c1/00785 - b81c1/00825
Official title: {Methods for preserving structures not provided for in groups B81C1/00785 - B81C1/00825}
B81C1/00833 (Methods for preserving structures not provided for in groups b81c1/00785 - b81c1/00825) appears on 21 US grants and 29 published applications in this corpus.
Search patents in B81C- Granted patents
- 21
- Published applications
- 29
- Assignees
- 17
- Inventors
- 58
- Latest grant
- 13 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 1 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 3 |
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 2 | 6 |
| 2017 | 2 | 0 |
| 2018 | 2 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 1 |
| 2021 | 0 | 2 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 1 |
| 2025 | 1 | 0 |
By publication year.
Recent patents
- Device for protecting FEOL element and BEOL element13 May 2025US 12,297,103 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectromechanical structure including a functional element situated in a cavity of the microelectromechanical structure26 Mar 2024US 11,939,215 B2Robert Bosch GmbH
- MEMS device manufacturing method and mems device7 Mar 2023US 11,597,648 B2Murata Manufacturing Co., Ltd.
- Device for protecting FEOL element and BEOL element31 May 2022US 11,345,591 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Process for the exposure of a region on one face of an electronic device20 Oct 2020US 10,809,621 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Semiconductor component and method for manufacturing a semiconductor component13 Jun 2024US 2024/0190702 A1
- Device for protecting feol element and beol element15 Sep 2022US 2022/0289564 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectromechanical structure including a functional element situated in a cavity of the microelectromechanical structure29 Jul 2021US 2021/0229986 A1Robert Bosch GmbH
- Mems device manufacturing method and mems device20 May 2021US 2021/0147224 A1Murata Manufacturing Co., Ltd.
- Device for protecting feol element and beol element16 Apr 2020US 2020/0115223 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for manufacturing semiconductor pressure sensor having reference pressure chamber27US 6,495,389 B2Denso Corporation · 2002
- Method for stripping sacrificial layer in MEMS assembly11US 6,951,769 B2Texas Instruments Incorporated · 2005
- MEMS microphone4US 9,807,517 B2AAC Technologies PTE.Ltd. · 2017
- Device and method for protecting FEOL element and BEOL element3US 10,155,660 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Self-shadowing MEM structures2US 6,824,278 B2MEMX, Inc. · 2004