MEMS device manufacturing method and mems device
AssigneeMurata Manufacturing Co., Ltd.
InventorMasakazu Fukumitsu
Life of this patent
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Abstract
A MEMS device and a MEMS device manufacturing method are provided for suppressing damage to device parts. An exemplary method of manufacturing a resonance device includes radiating laser light from a bottom surface side of a second substrate to form modified regions inside the second substrate along dividing lines of a first substrate, which has device parts formed on a top surface thereof, and the second substrate, the top surface of which is bonded to the bottom surface of the first substrate via bonding portions. The method further includes dividing the first and second substrates along the dividing lines by applying stress to the modified regions. The bonding portions are formed along the dividing lines and block the laser light.
Claims13
A MEMS device manufacturing method comprising:
- radiating laser light from a second main surface side of a second substrate to form a modified region inside the second substrate along a dividing line of the second substrate and a first substrate that has a device part disposed on a first main surface thereof;
- bonding a first main surface of the second substrate to a second main surface of the first substrate via a bonding portion that is formed along the dividing line, with the bonding portion constructed to block at least a portion of the laser light;
- and
- applying stress to the modified region of the second substrate to divide the first substrate and the second substrate,
- wherein the device part includes a plurality of electrode pads and the method further comprises disposing the plurality of electrode pads on the device part, such that each electrode pad is disposed at a distance from the dividing line at the first main surface of the first substrate and none of the plurality of electrode pads overlap the dividing line in a direction orthogonal to the first main surface.
A MEMS device manufacturing method comprising:
- radiating laser light from a first surface side of a first substrate to form a modified region inside the first substrate along a dividing line that extends in a direction perpendicular to the first surface side;
- bonding a main surface of a second substrate to a main surface of the first substrate via a bonding portion that is formed along the dividing line, with the bonding portion constructed to block at least a portion of the laser light;
- applying stress to the modified region of the first substrate to collectively divide the first substrate and the second substrate;
- and
- disposing a device part with a plurality of electrode pads in the first main surface of the substrate, such that each of the plurality of electrode pads are disposed at a distance from the dividing line at the first main surface of the first substrate and none of the plurality of electrode pads overlap the dividing line in a direction orthogonal to the first main surface.
Dependencies are inferred from the claim text.