Device for protecting feol element and beol element
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPing-Chun YEH, Lien-Yao TSAI, Shao-Chi YU
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Abstract
A method includes forming a front-end-of-the-line (FEOL) element over a substrate; forming a back-end-of-the-line (BEOL) element over the FEOL element; forming an interconnection structure over the substrate; forming a conductive shielding layer electrically connected to the interconnection structure and vertically overlapping the FEOL element and the BEOL element, wherein the conductive shielding layer is grounded to the substrate through the interconnection structure; and forming a dielectric layer covering the conductive shielding layer.
Claims20
A method, comprising:
- forming a front-end-of-the-line (FEOL) element over a substrate;
- forming a back-end-of-the-line (BEOL) element over the FEOL element;
- forming an interconnection structure over the substrate;
- forming a conductive shielding layer electrically connected to the interconnection structure and vertically overlapping the FEOL element and the BEOL element, wherein the conductive shielding layer is grounded to the substrate through the interconnection structure;
- and
- forming a dielectric layer covering the conductive shielding layer.
A method, comprising:
- forming a front-end-of-the-line (FEOL) element over a substrate;
- forming a back-end-of-the-line (BEOL) element over the FEOL element;
- forming a first interconnection structure over the substrate;
- forming a dielectric layer covering the first interconnection structure;
- and
- forming a micro electromechanical system (MEMS) wafer over the dielectric layer and vertically overlapping the FEOL element and the BEOL element, wherein the MEMS wafer is grounded to the substrate through the first interconnection structure.
A method, comprising:
- forming a front-end-of-the-line (FEOL) element over a substrate;
- forming a back-end-of-the-line (BEOL) element over the FEOL element;
- forming an interconnection structure over the substrate;
- forming a conductive shielding layer electrically connected to the interconnection structure;
- and
- forming a micro electromechanical system (MEMS) wafer having a MEMS device over the conductive shielding layer, wherein the conductive shielding layer and the MEMS wafer are grounded to the substrate through the interconnection structure.
Dependencies are inferred from the claim text.