MEMS microphone
AssigneeAAC Technologies Pte. Ltd.
InventorsHu Chen, Kai Wang
Life of this patent
Estimating the term…
Abstract
The MEMS microphone includes a first circuit board; a second circuit board keeping a distance from the first circuit board; a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole; an ASIC chip located in the cavity; and an MEMS chip having a back cavity. The first circuit board is electrically connected with the second circuit board by the plated-through-hole. The frame includes a conductive layer and an insulating layer, and the conductive layer is located between an inner surface of the frame and the insulating layer.
Claims7
A MEMS microphone, comprising:
- a first circuit board with planar structure;
- a second circuit board with planar structure keeping a distance from the first circuit board;
- a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole;
- an ASIC chip located in the cavity;
- and
- an MEMS chip having a back cavity;
- wherein the plated-through-hole runs through the whole frame, the first circuit board is electrically connected with the second circuit board by the plated-through-hole, the frame includes a conductive layer and an insulating layer, the conductive layer is located between an inner surface of the frame and the insulating layer, and the inner surface is faced to the cavity.
Dependencies are inferred from the claim text.