US 10,809,621 B2 · Process for the exposure of a region on one face of an electronic device

Abstract

A process for exposing at least one region of a face, known as the front face, of an electronic device, the process including the following steps: A bonding step for a cover (600) to the front face, the bonding being undertaken such that the cover (600) forms a closed cavity (650) with the region, advantageously hermetically sealed; Formation of an encapsulation coating (700), of thickness E1, covering the front face and the cover (600); A thinning step for the encapsulation coating (700), the thinning step including removal of a removal thickness E2, less than the thickness E1, of the encapsulation coating (700), the removal thickness E2 being adjusted such that an opening is formed in the cover (600).

Claims19

Dependent claims

An exposure process for at least one region (200) of a face, known as the front face (110), an electronic device (100), the process including the following steps:

a) A step for bonding for at least one cover (600) on the front face (110), the bonding being carried out such that the cover (600) forms a closed cavity (650) with the region (200), advantageously hermetically sealed;
b) Formation of an encapsulation coating (700), of thickness E1, covering the front face (110) and the at least one cover (600);
c) A step for thinning for the encapsulation coating (700), the thinning step including removal of a thickness E2, which is less than thickness E1, of the encapsulation coating (700), the removal thickness E2 being adapted such that an opening is formed in the cover (600).

Dependencies are inferred from the claim text.

Facts

Application

16/226,009Filed 19 Dec 2018

Priority

FR 17 6288721 Dec 2017

Published

US 2019/0196333 A127 Jun 2019

Granted

20 Oct 2020

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

G03F 7/2022
Exposure; Apparatus therefor: multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g.…
B81B 7/0032
Microstructural systems ; Auxiliary parts of microstructural devices or systems: packages or encapsulation
B81B 7/02
Microstructural systems ; Auxiliary parts of microstructural devices or systems: containing distinct electrical or optical devices of particular…
B81C 1/0023
Integrating an electronic processing unit with a micromechanical structure: packaging together an electronic processing unit die and a…

Process for the exposure of a region on one face of an electronic device

Life of this patent

Process for the exposure of a region on one face of an electronic device

Life of this patent

Abstract

Claims19