Methods of making a MEMS device by monitoring a process parameter
AssigneeQUALCOMM MEMS Technologies, Inc.
InventorMarjorio Rafanan
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Abstract
Embodiments of the present invention relate to methods and systems for making a microelectromechanical system MEMS device comprising supplying an etchant to etch one or more sacrificial structures of the system in a chamber. A process parameter relating to the pressure within the chamber is monitored as a function of time to provide an indication of the extent of the etching of the one or more sacrificial structures.
Claims71
A method for making a microelectromechanical systems (MEMS) device, comprising:
- (a) providing a chamber and an unreleased MEMS device situated therein, the unreleased MEMS device comprising a sacrificial structure;
- (b) supplying an etchant to the chamber to thereby etch the sacrificial structure;
- (c) monitoring a process parameter related to the pressure within the chamber as a function of time to thereby provide an indication of the extent of etching of the sacrificial structure;
- and
- (d) removing from the chamber at least a portion of a gaseous product that is formed from the etching of the sacrificial structure with the etchant.
A method for making a microelectromechanical systems (MEMS) device, comprising:
- (a) providing a chamber and an unreleased MEMS device situated therein, the unreleased MEMS device comprising a sacrificial structure;
- (b) supplying an etchant to the chamber to thereby etch the sacrificial structure;
- and
- (c) monitoring a process parameter related to the pressure within the chamber as a function of time to thereby provide an indication of the extent of etching of the sacrificial structure, wherein the indication is provided when the monitored process parameter crosses a pre-selected threshold.
A method for making a microelectromechanical systems (MEMS) device, comprising:
- (a) providing a chamber and an unreleased MEMS device situated therein, the unreleased MEMS device comprising a sacrificial structure;
- (b) supplying an etchant to the chamber to thereby etch the sacrificial structure;
- and
- (c) monitoring a process parameter related to the pressure within the chamber as a function of time to thereby provide an indication of the extent of etching of the sacrificial structure;
- wherein the unreleased MEMS device comprises:
- a substrate;
- one or more first layers positioned over the substrate;
- a sacrificial layer comprising a sacrificial structure positioned over the one or more first layers;
- and
- one or more second layers positioned over the sacrificial layer.
Dependencies are inferred from the claim text.