Micromechanical component for a sensor device or microphone device

A manufacturing method for a micromechanical component for a sensor device or microphone device, the method comprising:

• establishing a volume of a subsequent cavity of a subsequent micromechanical component at least by forming at least one sacrificial layer made of at least one electrically insulating sacrificial layer material, an electrode structure that is at least partially enclosed by the volume of the subsequent cavity being formed;
• forming a diaphragm of the subsequent micromechanical component, including a diaphragm inner side that delimits the subsequent cavity, the electrode structure, at least in part, being at least partially directly or indirectly connected to the diaphragm inner side;
• forming the cavity of the subsequent micromechanical component at least by removing at least one area of the at least one sacrificial layer made of the at least one electrically insulating sacrificial layer material so that the diaphragm inner side of the diaphragm adjoins the cavity, and the electrode structure, which is directly or indirectly connected to the diaphragm inner side, at least in part, is at least partially enclosed by the cavity, at least one residual area of the at least one sacrificial layer made of the at least one electrically insulating sacrificial layer material still remaining at the micromechanical component;
• and
• forming at least one insulation area made of at least one electrically insulating material that is not the same as the at least one electrically insulating sacrificial layer material, so that the electrode structure is electrically insulated from the diaphragm and/or the at least one residual area of the at least one sacrificial layer is delimited from the cavity, using the at least one insulation area;
• wherein the removal of the at least one area of the at least one sacrificial layer made of the at least one electrically insulating sacrificial layer material takes place by etching the particular area of the at least one sacrificial layer with an etching medium for which the at least one electrically insulating material of the at least one insulation area has a higher etch resistance than the at least one electrically insulating sacrificial layer material.

A manufacturing method for a micromechanical component for a sensor device or microphone device, the method comprising:

• establishing a volume of a subsequent cavity of a subsequent micromechanical component at least by forming at least one sacrificial layer made of at least one electrically insulating sacrificial layer material, an electrode structure that is at least partially enclosed by the volume of the subsequent cavity being formed;
• forming a diaphragm of the subsequent micromechanical component, including a diaphragm inner side that delimits the subsequent cavity, the electrode structure, at least in part, being at least partially directly or indirectly connected to the diaphragm inner side;
• forming the cavity of the subsequent micromechanical component at least by removing at least one area of the at least one sacrificial layer made of the at least one electrically insulating sacrificial layer material so that the diaphragm inner side of the diaphragm adjoins the cavity, and the electrode structure, which is directly or indirectly connected to the diaphragm inner side, at least in part, is at least partially enclosed by the cavity, at least one residual area of the at least one sacrificial layer made of the at least one electrically insulating sacrificial layer material still remaining at the micromechanical component;
• and
• forming at least one insulation area made of at least one electrically insulating material that is not the same as the at least one electrically insulating sacrificial layer material, so that the electrode structure is electrically insulated from the diaphragm and/or the at least one residual area of the at least one sacrificial layer is delimited from the cavity, using the at least one insulation area;
• wherein for establishing the volume of the subsequent cavity and for forming the electrode structure, a substrate surface of a substrate and/or at least one intermediate layer that at least partially covers the substrate surface is covered with a first sacrificial layer as the at least one sacrificial layer made of the at least one electrically insulating sacrificial layer material, a side of the first sacrificial layer directed away from the substrate is at least partially covered with an electrode material layer so that the electrode structure is formed from at least partial areas of the electrode material layer, and a side of the electrode material layer directed away from the first sacrificial layer is at least partially covered with a second sacrificial layer as the at least one sacrificial layer made of the at least one electrically insulating sacrificial layer material.