B81C 1/00039
Anchors
Official title: {Anchors}
B81C1/00039 (Anchors) appears on 47 US grants and 56 published applications in this corpus.
Search patents in B81C- Granted patents
- 47
- Published applications
- 56
- Assignees
- 37
- Inventors
- 123
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 2 | 3 |
| 2011 | 4 | 2 |
| 2012 | 0 | 5 |
| 2013 | 3 | 4 |
| 2014 | 6 | 6 |
| 2015 | 4 | 4 |
| 2016 | 3 | 2 |
| 2017 | 5 | 4 |
| 2018 | 0 | 1 |
| 2019 | 1 | 4 |
| 2020 | 5 | 4 |
| 2021 | 2 | 2 |
| 2022 | 4 | 3 |
| 2023 | 0 | 2 |
| 2024 | 3 | 1 |
| 2025 | 3 | 1 |
| 2026 | 1 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Anchor structure8 Sep 2026US 12,729,107 B2Lawrence Semiconductor Research Laboratory, Inc.
- Method of making mems microphone with an anchor9 Dec 2025US 12,495,260 B2Skyworks Solutions, Inc.
- Micro-device structures with etch holes21 Oct 2025US 12,448,283 B2X-Celeprint Limited
- Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device17 Jun 2025US 12,332,271 B2Infineon Technologies AG
- Microstructure and method of producing a microstructure27 Aug 2024US 12,071,341 B2ams International AG
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Microelectromechanical system device with filled via12 Mar 2026US 2026/0070778 A1
- Method for attaching a bridging metal layer in via holes for supporting posts19 Feb 2026US 2026/0048982 A1National Chung Shan Institute of Science and Technology
- Microelectromechanical system device with elongated via5 Feb 2026US 2026/0036805 A1
- Anchor structure30 Jan 2025US 2025/0033951 A1Lawrence Semiconductor Research Laboratory, Inc.
Most cited
By later US patents
- MEMS devices and methods of forming the same51US 9,181,083 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- SOI polysilicon trench refill perimeter oxide anchor scheme36US 6,913,941 B2Freescale Semiconductor, Inc. · 2005
- Performance-enhancing two-sided MEMS anchor design for vertically integrated micromachined devices15US 7,863,698 B2InvenSense, Inc. · 2011
- MEMS coupler and method to form the same8US 7,858,422 B1Silicon Labs SC, Inc. · 2010
- Method for producing a device comprising cavities formed between a suspended element resting on insulating pads semi-buried in a substrate and this substrate5US 9,029,178 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2015