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US 2026/0070778 A1Published application
Microelectromechanical system device with filled via
OwnerSean C. O'BRIEN, John HAMLIN +3inventors
InventorsSean C. O'BRIEN, John HAMLIN, Song ZHENG, Christopher BEARD, Andrew CHEN
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Abstract
A microelectromechanical system (MEMS) device includes: a mechanical layer; a second layer; and a via coupled between the mechanical layer and the second layer. The via comprising a metal layer having a bottom and sides, and oxide on the bottom of the metal layer between the sides of the metal layer.
Claims20
A microelectromechanical system (MEMS) device comprising:
- a mechanical layer;
- a second layer;
- and
- a via coupled between the mechanical layer and the second layer, the via comprising a metal layer having a bottom and sides, and oxide on the bottom of the metal layer between the sides of the metal layer.
1 more element
A method of manufacturing a microelectromechanical system (MEMS) device, the method comprising:
- forming an opening in a sacrificial layer;
- depositing metal in the opening to form a via;
- filling the via with spin-on oxide filler;
- and
- etching the spin-on oxide filler.
2 more elements
A microelectromechanical system (MEMS) device comprising:
- a mirror layer;
- an electrode layer including an electrode;
- a hinge layer;
- a first via coupling the hinge layer and the mirror layer;
- and
- a second via coupling the hinge layer and the electrode, the second via comprising an oxide filler.
3 more elements
Dependencies are inferred from the claim text.