Method for producing a device comprising cavities formed between a suspended element resting on insulating pads semi-buried in a substrate and this substrate

A method for producing a device including plural gaps of different height defined between a substrate in at least one given semiconductor material and a suspended element resting on a top of at least one post projecting from the substrate and electrically insulating the suspended element from the substrate, the method comprising:

• a) forming one or more posts contiguous with one or more regions of an upper surface of a substrate in the at least one given semiconductor material;
• b) modifying, by at least one etching and/or at least one addition of semiconductor material, a distance between at least one given region from among the regions of the upper surface and the top of at least one of the posts contiguous with the given region, the addition of semiconductor material and/or etching being conducted through a mask protecting at least one other region from among the regions of the upper surface of the substrate, the posts after the modifying b) including at least one part located in the substrate and surrounded by the at least one given semiconductor material;
• and
• c) forming a suspended element on the top of the at least one post.