B81B 2201/0242
Gyroscopes
B81B2201/0242 (Gyroscopes) appears on 734 US grants and 911 published applications in this corpus.
Search patents in B81B- Granted patents
- 734
- Published applications
- 911
- Assignees
- 198
- Inventors
- 1,326
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 0 |
| 2002 | 1 | 3 |
| 2003 | 3 | 4 |
| 2004 | 7 | 10 |
| 2005 | 10 | 7 |
| 2006 | 4 | 5 |
| 2007 | 6 | 6 |
| 2008 | 6 | 8 |
| 2009 | 3 | 14 |
| 2010 | 5 | 17 |
| 2011 | 5 | 11 |
| 2012 | 15 | 18 |
| 2013 | 19 | 23 |
| 2014 | 20 | 44 |
| 2015 | 31 | 66 |
| 2016 | 51 | 74 |
| 2017 | 82 | 87 |
| 2018 | 56 | 74 |
| 2019 | 63 | 76 |
| 2020 | 69 | 67 |
| 2021 | 61 | 57 |
| 2022 | 47 | 57 |
| 2023 | 55 | 51 |
| 2024 | 36 | 47 |
| 2025 | 38 | 46 |
| 2026 | 31 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit for operating a capacitive sensor and sensor apparatus6 Oct 2026US 12,754,221 B2Robert Bosch GmbH
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- Inertia measurement device, vehicle, and electronic device15 Sep 2026US 12,736,558 B2Seiko Epson Corporation
- Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device1 Sep 2026US 12,722,969 B2STMicroelectronics S,r.l.
- Microelectromechanical device with recovery from stiction conditions1 Oct 2026US 2026/0296874 A1STMicroelectronics International N. V.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Semiconductor device17 Sep 2026US 2026/0274648 A1Infineon Technologies AG
- Device and method of manufacturing device10 Sep 2026US 2026/0265048 A1Tazmo Co., Ltd.
- Microelectromechanical device and a method20 Aug 2026US 2026/0242204 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- CMOS-MEMS device structure, bonding mesa structure and associated method235US 9,656,852 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Gimballed vibrating wheel gyroscope having strain relief features82US 5,650,568 AThe Charles Stark Draper Laboratory, Inc. · 1997
- MEMS integrated pressure sensor devices and methods of forming same66US 9,040,334 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Air-release features in cavity packages65US 8,853,839 B2Analog Devices, Inc. · 2014